Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Shigeru Koibuchi

Asao Isobe

Daisuke Makino

Nobuo Miyadera

Michiaki Hashimoto

Hitoshi Yokono

Nobuyuki Hayashi

Fusaji Shoji

Hiroshi Shiraishi

Fumio Kataoka

Toshihiro Kuroda

Toshiaki Ishimaru

Tooru Takahashi

Masatoshi Yamaguchi

Katsushige Tsukada

Yutaka Takeda

Minoru Toriumi

Ryotaro Irie

Kyouichi Sasaki

An optical connecting structure has an optical fiber, a pressing member having a circular outer cross section, and an optical member, wherein the optical member has an optical element, an optical fiber stopper structure, and an optical fiber holding groove, wherein the optical fiber stopper structure is positioned between the optical element and the optical fiber holding groove, wherein the optical fiber is inserted along the optical fiber holding groove so as to contact with the optical fiber stopper structure, and wherein the pressing member is arranged on the optical fiber holding groove mutually perpendicular, the pressing member presses the upper surface of the optical fiber to a direction of a bottom of the optical fiber holding groove, and the optical fiber and the optical element are thereby optically connected.

Optical connecting structure

The present invention provides a polymeric optical waveguide film whose core and clad are constituted from polymer materials and which is characterized in that a protective layer of a polymer material having resistance to solvent attack higher than that observed for the clad is arranged on at least one of the surface and back face of the waveguide film. The present invention thus permits the preparation of such a film, the clad of which is hardly damaged, which is excellent in the resistance to solvent attack and which never undergoes cracking even when it is bought into contact with a commonly used solvent such as acetone.

Polymeric optical waveguide film

A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, has a strong absorption against a light of a wavelength of 365 nm and is suitable for producing semiconductor elements, etc.

Photosensitive quinone diazide and resin composition having high

Photosensitive resin composition and pattern formation using the same

A developing solution comprising at least two compounds selected from choline and quaternary ammonium salts is suitable for developing a negative-type photosensitive resin composition with exposure to a smaller light amount.

Process for producing a pattern with negative-type photosensitive

A photosensitive composition comprising (a) a photosensitive component such as an aromatic diazo compound or an aromatic azide, (b) a polymer and (c) a quaternary alkylammonium salt wherein each straight- or branched-chain alkyl group has 1 to 7 carbon atoms is suitable for producing a positive type or negative type photresist excellent in contrast and sensitivity in the microlithography of semiconductor elements.

Photosensitive composition

Fine patterns with high degree of resolution and high resistance to etching can be produced by coating a solution of a photosensitive composition comprising (a) an aromatic azide compound and (b) an alkaline-aqueous-solution-soluble polymer on a substrate, exposing predetermined portions of the coated photosensitive composition to ultraviolet light, developing with an alkaline aqueous solution to form a resist pattern, and etching the substrate using said resist pattern as a mask.

Process for producing fine patterns

4'-Azidobenzal-2-methoxyacetophenone is an excellent photosensitive compound and can give a photosensitive composition together with an alkaline-aqueous-solution-soluble polymer which can be insolubilized in an alkaline aqueous solution by photochemical curing with 4'-azidobenzal-2-methoxyacetophenone, and if necessary together with an organic solvent, said composition showing a very small change in viscosity with the lapse of long time.

Photosensitive composition with 4-azido-2'-methoxychalcone

Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition. Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

Photosensitive resin composition and method for forming fine patterns

A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.

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Hitachi, Japan

Shigeru Koibuchi