Tokyo Ohka Kogyo Co., Ltd.

Shigeru Kawata

Futoshi Shimai

The object of the present invention is to provide a cooling apparatus which makes it possible to cool a substrate uniformly in a short period of time even if the substrate has a large area. The cooling apparatuscomprises a flat-box-shaped body, a cooling medium supply tubewhich is inserted into the body, a nozzlewhich is attached to the cooling medium supply tubeso as to eject the cooling medium toward the internal surface of the body, a pipefor withdrawing water (refrigerant) ejected from the nozzletoward the body, a chillerfor cooling the water from the pipeto a predetermined temperature, and a circulating pipefor sending the water which has been cooled by the chillerback to the cooling medium supply tube

Cooling apparatus and substrate treating apparatus

A slit nozzle which is easily manufactured and in which no capillary action occurs, and an apparatus for supplying a treatment liquid using the slit nozzle are disclosed. The slit nozzle is constructed of a left portion and a right portion joined to each other, one of which is made of metal and the other of which is made of resin. In the apparatus for supplying a treatment liquid using one or more of the slit nozzles, the slit nozzles are provided in a circulating passage of a treatment liquid whose temperature is controlled.

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Kanagawa, Japan

Shigeru Kawata