Nhk Spring Co., Ltd.

Other

Kabushiki Kaisha Toshiba

Shigeru Kawaguchi

Michiya Masuda

Shinji Kobayashi

Michihiko Inaba

Hisamatsu Nakano

Takeshi Narita

Takaaki Murata

Ichiro Yamanashi

Yutaka Natsume

Yasuhiro Ogura

Shigemi Sato

Junji Yamauchi

Ryouichi Tazawa

Yuichi Yamamoto

Yuuji Okita

Yutaka Natume

Sueo Ando

Takayuki Senda

An optical multi-demultiplexer of the present invention comprises an input waveguide to which wavelength division multiple signals are applied, a plurality of output waveguides for demultiplexing and outputting the wavelength division multiple signals, an arrayed waveguide including a plurality of channel waveguides having different waveguide lengths, an input slab waveguide, and an output slab waveguide. The input slab waveguide is provided between the input waveguide and the arrayed waveguide. The output slab waveguide is provided between the arrayed waveguide and the output waveguides. The input slab waveguide is formed with tapered island regions having a refractive index lower than that of the core layer of the slab waveguide. The island regions are situated in positions opposite the channel waveguides of the arrayed waveguide.

Optical multi-demultiplexer

Proposed is a method for fabricating a planar optical waveguide device having a plurality of core segments formed between a lower clad layer and an upper clad layer, in which a hot isostatic pressing process (HIP) is carried out during the fabrication process. The lower clad layer may consist of a substrate or a buffer layer formed on a substrate. Each layer may be formed either by a low-temperature film-forming process such as CVD or by the flame hydrolysis pressing process. The HIP process is also effective in eliminating voids when the core is formed in a recess of the lower clad layer. According to the tests conducted by the inventors, it was found that the HIP process can be conducted without requiring any protective layer or a gas barrier through proper selection of the condition for the HIP process, as opposed to the common belief that a protective layer or a gas barrier is essential for the HIP process.

Method for fabricating planar optical waveguide devices

An optical device comprises a substrate, an optical waveguide, a laser diode, photodiodes, and a filter. The substrate is provided with a flat reference surface and a V-groove recessed from the reference surface. A pin is fitted in the V-groove of the device and a V-groove of a connector. The optical waveguide is formed on the reference surface. The optical waveguide is provided with a core and a cladding. The core extends along the reference surface. The laser diode emits a signal light beam with a first wavelength toward the core and the photodiode, individually. The filter transmits the signal light beam with the first wavelength and reflects a signal light beam with a second wavelength. The signal light beam reflected by the filter is received by a photodiode.

Optical device and optical module provided with optical device

A pair of electrodes (,) are formed on one surface of a dielectric substrate (,). A dielectric layer (,) is formed on the surface of the dielectric substrate (,) so as to cover the pair of electrodes (,). The pair of electrodes (,) have linear electrode elements, respectively. The respective linear electrode elements are arrange at equal intervals.

Ozonizing unit ozone generator and ozone-processing system

An optical waveguide device is provided with a core formed on a substrate and a clad layer. A low-temperature film-forming method, such as the CVD or PVD method, is used in a core forming process for forming the core and a clad forming process for forming the clad layer. The surface of the clad layer is coated with a protective film of chrome or the like in a protective film forming process that is carried out after the clad forming process. In a heating/pressurizing process that is carried out after the protective film forming process, the clad layer is heated and pressurized from its outside by the HIP (hot isostatic pressing) method. This heating/pressurizing process substantially eliminates voids in the clad layer and the like, and enhances or improves the density of a buffer layer, core, and upper clad layer and the transparency of the core layer. The protective film is removed by etching or the like in a removing process.

Hot Isostatic pressing of a planar optical waveguide

Growing community of inventors

Yokohama, Japan

Shigeru Kawaguchi