Tokyo Electron Limited

Tel-varian Limited

Other

Tokyo Electron Limi Ted

Nagano Japan Radio Co., Ltd.

Tokyo Electronics Limited

Shigeru Kasai

Yuki Osada

Taro Ikeda

Masatake Yoneda

Hiroyuki Miyashita

Tomohiro Suzuki

Takashi Ogino

Hiroyuki Nakayama

Masahiro Shimizu

Yutaka Fujino

Tomohito Komatsu

Koichi Rokuyama

Toshiaki Kitamura

Sumi Tanaka

Masahito Kobayashi

Yoshinori Fujisawa

Akira Tanihara

Yutaka Akaike

Mitsutoshi Ashida

Naoki Akiyama

Ikuo Sawada

Nobuhiko Yamamoto

Takashi Kakegawa

Masamichi Nomura

Kazuhiro Ooya

Susumu Saito

Naoki Shindo

Kohei Kawamura

Teruo Iwata

Jun Yamashita

Yusuke Muraki

Ayuta Suzuki

Tomihiro Yonenaga

Kenjiro Koizumi

Hiroyuki Kobayashi

Hikaru Adachi

Yoshiyasu Kato

Masakazu Ban

Koichi Yamazaki

Songyun Kang

Hatsuo Osada

Kotaro Miyatani

Dai Kobayashi

Jun Nakagomi

Minoru Yazawa

Yuji Obata

Masaki Sohma

Masao Kubodera

Hiroaki Agawa

Tetsuya Saito

Ryoji Yamazaki

Katsumi Sekiguchi

Tomohiro Ota

Masato Kubodera

Taro Komiya

Takuya Kurotori

Kenichi Kote

Tomoki Nukanobu

Yoshiyuki Morifuji

Hiroaki Komiya

Fumiya Fujii

Emiko Hara

Naoto Ikeda

Akihiro Kubota

Fumio Yamada

Miwa Shimizu

Sum Tanaka

Norihiko Yamamoto

Kenichi Yanagitani

There is provided an LED chuck comprising: a top plate on which an object to be inspected is mounted; an LED array substrate disposed to face the object to be inspected, and provided with a plurality of LEDs for heating the object to be inspected that is mounted on the top plate; a cooling plate disposed on a back side of the LED array substrate; an LED control substrate disposed on a back side of the cooling plate and controlling the plurality of LEDs; and a base plate disposed to surround the LED control substrate. A surface of the cooling plate facing the LED control substrate and a surface of the base plate facing the LED control substrate are formed of a magnetic material.

LED chuck

Disclosed is a method for controlling the temperature of a heater which has a single plate-shaped member formed of a semiconductor substrate, and three or more electrodes formed on a side surface of the single plate-shaped member while being spaced apart from each other in a circumference direction, the method comprising a step for heating the plate-shaped member by supplying a power between the electrodes and sequentially changing the pair of electrodes to which the power is supplied, wherein a period of time in which the power is supplied between the electrodes in the heating step is individually determined for each set of electrodes.

Heater temperature control method, heater, and placement stand

In an inspection apparatus for inspecting an inspection target device formed on an inspection object, the inspection target device is a back-illuminated imaging device into which light is incident from a rear surface opposite to a side of a wiring layer. The inspection apparatus includes a stage having the inspection object placed such that the inspection object faces the rear surface. The stage includes a light transmitter made of a light-transmissive material. The inspection object is placed on the light transmitter below which a light illuminator is disposed. The light illuminator includes a flat light guide plate having a facing surface facing the inspection object. A light source is provided laterally outside the light guide plate configured to diffuse light emitted from the light source incident from a side end surface of the light guide plate, and to emit the light as planar light from the facing surface.

Inspection apparatus and inspection method

There is provided a placement table having an upper surface on which a device to be processed is placed. The placement table comprises: a top plate having a placement surface for the device; a heating unit configured to heat the top plate; a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view. The positioning unit is formed of a flexible substrate having flexibility.

Placement table, testing device, and testing method

A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

Dummy wafer

A power supply for supplying a power to a heating mechanism used for heating a measurement target that emits a measurement signal includes an input device configured to output an input signal that reflects a control signal in a differentiable periodic waveform having a frequency of 1 kHz or less. The power supply includes a switching amplifier configured to amplify the input signal from the input device and output the amplified signal.

Inspection apparatus including power supply for supplying power to heating mechanism used for heating device

There is provided a control method of a test device, the test device comprising a chuck on which an object to be tested is mounted, a tester configured to supply electric power to the object to be tested to test the object to be tested, and a controller configured to control a temperature of the chuck. The control method comprises: when an actual temperature of the object to be tested cannot be fed back, estimating a temperature difference between the temperature of the chuck and the temperature of the object to be tested on the basis of a heat amount of the object to be tested; correcting a target temperature of the chuck on the basis of a target temperature of the object to be tested and the temperature difference; and controlling the temperature of the chuck on the basis of the corrected target temperature of the chuck and an actual temperature of the chuck.

Test device control method and test device

A method for performing temperature control of a mounting base on which a substrate is to be mounted. A substrate mounting surface of the mounting base is divided in the radial direction into a plurality of regions, and a heater is provided to each of the plurality of regions. The method includes: a step for performing feedback control that adjusts the operation amount of the heater in the centermost region of the plurality of regions of the substrate mounting surface such that the centermost region is at a set temperature; and a step for performing feedback control that adjusts the operation amount of the heater in an outside region that is further to the outside than the centermost region of the plurality of regions of the substrate mounting surface such that the temperature difference between the outside region and the region that is adjacent to the outside region on the inside in the radial direction is a preset value.

Temperature adjustment method for mounting base, inspection device, and mounting base

A test wafer according to an embodiment of the present disclosure is a test wafer used for simulation of heat emission of devices on a wafer, and includes a silicon wafer and a silicon heater bonded to a surface of the silicon wafer.

Silicon heater bonded to a test wafer

An inspection apparatus is provided to inspect an imaging device formed on an inspection object by bringing a contact terminal into electrical contact with a wiring layer of the imaging device while causing light to enter the imaging device. The light enters the imaging device from a back surface that is a surface on the side opposite to the side on which the wiring layer is formed. The inspection apparatus includes a substrate support made of a light-transmissive material and on which the inspection object is supported such that the substrate support faces a back surface of the imaging device, and a light irradiation mechanism disposed to be opposite to the inspection object with the substrate support interposed therebetween and having a plurality of LEDs such that light from the LEDs is oriented toward the inspection object.

Inspection apparatus

An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.

There is provided a mounting table on which a workpiece is mounted, including: a plurality of layers including a ceiling layer having a front surface on which the workpiece is mounted, and a heating layer formed at a rear surface side of the ceiling layer and configured to heat the ceiling layer, the plurality of layers being stacked above one another. Each of the plurality of layers is formed by a silicon single crystal substrate or a silicon polycrystalline substrate. Each of the plurality of layers is bonded to a different layer which is adjacent in a stacking direction through oxide films formed on the silicon single crystal substrate or the silicon polycrystalline substrate.

Mounting table, and method of manufacturing the mounting table

An apparatus for inspecting an electronic device, includes: a placement table on which a substrate having the electronic device provided thereon is placed and including a refrigerant flow path; a light irradiation mechanism having LEDs directed to the substrate; and a controller for controlling heat absorption by the refrigerant and heating by light from the LEDs. The controller includes: a temperature information acquisition part for acquiring information on a temperature of the electronic device; a heating controller for performing the heating control based on the temperature of the electronic device as a current inspection object; and a heat absorption controller for estimating a transition of power applied to the electronic device at a next inspection based on a transition of the temperature of the electronic device in a past inspection, and performing the heat absorption control at a time of the next inspection.

Inspection apparatus and temperature control meihod

A testing device for inspecting an electronic device by causing contact terminals to electrically contact the electronic device, includes: a mounting table formed with a light transmission member opposite the side on which a inspection object is placed and having therein a coolant flow path through which a coolant capable of transmitting light flows; a light irradiation mechanism disposed so as to face the surface opposite the inspection object placement side of the mounting table, and having LEDs pointing toward the inspection object; and a controller controlling absorption of heat by the coolant and heating by the lights from the LEDs to control the temperature of the electronic device to be inspected. The controller controls the light output from the LEDs based on the measured temperature of the electronic device to be inspected and controls the absorption of heat by the coolant based on the LED light output.

Testing device

Provided is an electronic device inspection apparatus that suppresses cost increase. A prober is provided with a stage on which a carrier or a wafer is placed. The stage is provided with a stage cover on which the carrier is placed, a cooling unit in contact with the stage cover, and an LED irradiation unit facing the carrier across the stage cover and the cooling unit. Each of the stage cover and the cooling unit is formed of light-transmitting material. A light-transmitting coolant flows in a coolant flow path in the cooling unit. The LED irradiation unit has a plurality of LEDs oriented to the carrier. The carrier is formed of a glass substrate having a substantially disk-like shape. A plurality of electronic devices is arranged on a surface of the carrier at predetermined intervals.

Placement stand and electronic device inspecting apparatus

Growing community of inventors

Nirasaki, Japan

Shigeru Kasai