Hitachi Techno Engineering Co., Ltd.

Shigeru Ishida

Haruo Mishina

Tomio Yoneda

Yukihiro Kawasumi

Satoshi Yawata

Kiyoshi Imaizumi

Hiroshi Tsutsumi

Masayuki Saito

A paste applicator for drawing a paste film in a desired pattern on a substrate, including a table for detachably supporting a substrate, a paste reservoir tube to be filled with a paste, and a nozzle communicating with the paste reservoir and having a paste discharging port opposing to an upper surface of the substrate mounted on the table. A device is supplied for changing the relative positional relationship between the nozzle and the substrate mounted on the table. The paste is applied onto the substrate to form a desired pattern of the paste. A measuring device measures a position of a paste discharging port of a nozzle exchanged together with the paste reservoir tube by using a paste pattern formed by applying the paste onto the substrate held on the table using the exchanged nozzle. The center of the paste pattern nearly agrees with the center of the paste discharging port. A calculator calculates a positional displacement of the paste discharging port due to the nozzle exchange using the measured result obtained by the measuring device. A positioning device positions the substrate at a desired position with respect to the paste discharging port after nozzle exchange using the result obtained by the calculator.

Paste applicator having positioning means

An apparatus for applying a paste to a surface of a substrate by holding the substrate on a table and by moving a nozzle relative to the table to form a desired paste pattern on the substrate. The apparatus has a device for measuring the position of a paste ejection orifice of the nozzle, a processing unit for calculating, from a result of the measurement by the measuring device, a displacement of the position of the paste ejection orifice when the nozzle is changed, and a mechanism for positioning the substrate at a desired position with respect to the ejection orifice of the changed nozzle on the basis of a result of the operation of the processsing unit. With this arrangement, even if the position of the ejection orifice of the nozzle is changed when the nozzle is changed, the desired positional relationship between the nozzle and the substrate can be set with improved accuracy, whereby a paste pattern can be drawn accurately.

Apparatus for applying paste

An apparatus for drawing a pattern of a photoresist on a substrate has a nozzle for discharging the paste and a substrate-supporting table movable along the X and Y-axes relative to the paste drawing opening of the nozzle. The nozzle is fixed to a Z-axis table which carries an optical displacement meter which measures the clearance between the substrate and the paste discharging opening. According to the results of the measurements, the Z-axis table is moved toward and away from the substrate so that the clearance is maintained at a desired distance. The optical displacement meter has a measuring point on the substrate. The measuring point is positioned so as not to interfere with the paste line which is drawn on the substrate with paste discharged from the nozzle.

Apparatus for drawing paste pattern on substrate

A paste applicator for drawing a paste pattern on a substrate has X- and Y-axis tables, on which the substrate is mounted, and a paste reservoir tube, a nozzle, a nozzle support and an optical displacement meter all fixed to a Z-axis table in opposite relation to the substrate. The paste reservoir tube and the nozzle are communicated with each other by a horizontal portion of the nozzle support. The horizontal portion is extended to a position below the optical displacement meter so that the nozzle is located close to a measuring point of the optical displacement meter. This arrangement places the nozzle as close as possible to the measuring point of the optical displacement meter, whereby an error between data measured by the optical displacement meter and an actual nozzle-to-substrate gap is substantially eliminated to assure that the paste is applied to the substrate in a desired pattern and configuration.

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Shimoinayoshi, Japan

Shigeru Ishida