Mitsui Toatsu Chemicals, Incorporated

Shigeru Iimuro

Takashi Kitamura

Yoshio Morimoto

Hosei Shinoda

Masami Ohtaguro

Akihiro Funae

Mizuo Ito

Shinobu Moriya

Teruo Yuasa

Tomoyuki Kawabata

Yukio Fukui

Shinji Ando

Tomoko Takashima

Naru Koike

Yasuo Tanaka

Akira Yamada

Hidetoshi Kita

Kenichi Okamoto

Masahiko Asano

Kenichi Ohmura

Satoru Ito

Toshio Houri

Tsuguo Kawamura

Keiko Taniguchi

Masahiro Washino

Toshimiki Shimizu

A method for preparing 1,3-dihydroxy-4,6-bis�.alpha.-methyl-.alpha.-.alpha.(4'-hydroxyphenyl)ethy l!benzene represented by the following formula (1): ##STR1## comprising the step of initiating a reaction of resorcin with 4-isopropenylphenol in a mixed solvent which comprises a non-polar solvent and a polar solvent in the presence of an acidic catalyst. The method can easily be handled, ensures a high yield, permits the reduction of impurity content and can provide highly pure 1,3-dihydroxy-4,6-bis�.alpha.-methyl-.alpha.-(4'-hydroxyphenyl)ethyl!benze ne. The resulting phenolic compound is useful as, for instance, a branching agent for polycarbonates, polyesters or the like; a raw material for radiant ray-sensitive components for use as resist materials; a raw material for epoxy resins; and a hardening agent for epoxy resins.

Method for preparing

Articles matters which can be degraded and disappear in the natural environment are a degradable adhesive film which can be used for surface protection or indication after printing on the film surface and has an adhesive layer on one side of a substrate film obtained from a lactic acid base polymer such as polylactic acid and a lactic acid/hydroxycarboxylic acid copolymer having a molecular weight of 30,000.about.500,000, and a degradable resin composition which is excellent in weatherability and comprises 100 parts by weight of a lactic acid base polymer and 0.001.about.5 parts by weight of one or more additives selected from ultraviolet absorbers and light stabilizers.

Degradable adhesive film and degradable resin composition

An allyletherificated phenol aralkyl resin is obtained through the reaction of a phenol aralkyl resin with an allyl halide in the presence of a base in an organic solvent at room temperature to 100.degree. C. and changed into an allylated phenol aralkyl resin at 160.degree.-250.degree. C. through Claisen rearrangement. The two resins are low in melt viscosity. Epoxy resin compositions containing the allylated phenol aralkyl resin as the curing agent give cured products being excellent in heat and moisture resistances.

Phenol aralkyl resins, preparation process thereof and epoxy resin

A phenolic resin composition herein disclosed comprises, as essential components, (i) at least one phenol resin A selected from the group consisting of residues formed through purification of bisphenol A, residues obtained by cleaving the bisphenol A-purification residue, condensates of the bisphenol A-purification residue obtained by reacting the bisphenol A-purification residue with formaldehyde and condensates of the cleavage residue obtained by reacting the cleavage residue with formaldehyde, and (ii) at least one phenolic resin B selected from the group consisting of high-boiling fraction obtained through production of bisphenol F and condensates of the high-boiling fraction obtained by reacting the high-boiling fraction with formaldehyde. The phenolic resin composition can be used in making resin-coated sand particles which do not give out a bad smell and do not generate any soot and smoke during forming a mold by the shell molding method and which have good disintegration properties without using any sand-baking process.

Phenolic resin compositions derived from bisphenol compounds and their

A phenolic resin composition comprises a mixture of 100 parts by weight of a phenol aralkyl resin and 5 to 60 parts by weight of a novolak type phenolic resin having a content of binuclear components of not more than 10% by area, and a content of trinuclear components of not less than 50% by area and a sum content of tri- and tetra-nuclear components of 75% by area based on the total novolak phenolic resin except for the binuclear components, and an epoxy-cured product obtained by curing an epoxy resin while using the phenolic resin composition as set forth in claim 1 as a curing agent. The phenolic resin composition has a low viscosity and, when it is used as a curing agent for epoxy resins, the resulting epoxy-cured product has a low water absorption rate, is excellent in resistance to moisture and has a high glass transition temperature as compared with the cured product obtained using a novolak type phenolic resin as a curing agent.

Phenolic resin composition

Articles which can be degraded and disappear in the natural environment are a degradable adhesive film which can be used for surface protection or indication after printing on the film surface and has an adhesive layer on one side of a substrate film obtained from a lactic acid base polymer such as polylactic acid and a lactic acid/hydroxycarboxylic acid copolymer having a molecular weight of 30,000-500,000, and a degradable resin composition which is excellent in weatherability and comprises 100 parts by weight of a lactic acid base polymer and 0.001-5 parts by weight of one or more additives selected from ultraviolet absorbers and light stabilizers.

A degradable non-woven fabric obtained from an web formed of lactic acid-based polymer filaments comprising of one or more lactic acid-based polymers selected from a poly (DL-lactic acid) having more than 80 mol % of L-lactic acid units, poly (DL-lactic acid) having more than 80 mol % of D-lactic acid units, L-lactic acid/hydroxycarboxylic acid copolymer having 70 mol % or more of L-lactic acid units, and D-lactic acid/hydroxycarboxylic acid copolymer having 70 mol % or more of D-lactic acid units, and a preparation process of the degradable non-woven fabric which has good dimensional stability and can be degraded and disappeared under natural environment when abandoned.

Degradable non-woven fabric and preparation process thereof

In the preparation of polyester by conducting ring-opening polymerization of a cyclic ester compound in the presence of a hydroxyl compound as a molecular weight regulator in the reaction system, the molecular weight of polyester can be accurately controlled in the desired range by previously estimating the amount of free carboxylic acid contained in the cyclic ester compound and controlling the amount of the hydroxyl compound on the basis of the estimated amount.

Preparation process of polyester

Crystals of 6,6'-dihydroxy-3,3,3',3'-tetramethyl -1,1'-spirobiindane (hereinafter referred to as SPI) are obtained by cooling a phenol solution containing 6,6'-dihydroxy-3,3,3',3'-tetramethyl-1,1'-spirobiindane when crystallization is started at a temperature higher than a transition temperature between SPI and an adduct of SPI with phenol. The crystals are washed with an organic solvent or contacted with water and further washed with an organic solvent. When crystallization is started at a temperature less than the transition temperature, adduct crystals of SPI with phenol are obtained from the phenol solution. Phenol is removed from the adduct crystals and the adduct crystals are contacted with water to obtain a hydrate and further the hydrate is washed with an organic solvent.

Preparation of 6,6'-dihydroxy-3,3,3',3'-tetramethyl-1,1'-spirobiindane

Herein disclosed is a method for simultaneously preparing a highly pure bisphenol F and/or a bisphenol F for general use and a novolak phenol resin and/or a high molecular weight novolak phenol resin comprising the steps of:

Method for simultaneous preparation of bisphenol F and novolak phenol

A phenolic resin can be obtained by a condensation reaction between a specific trifunctional aromatic compound and a phenolic compound. This resin can be reacted with a curing agent such as a hexamine to give cured articles having excellent heat resistance, electrical properties, wear resistance and chemical resistance, and the phenolic resin is also much more excellent in curing reactivity as compared with conventional techniques.

Phenolic resin and method for preparing same

A method for preparing 1,1,2,2-tetrakis(4-hydroxy-3,5-dimethylphenyl)ethane (TKXE) comprising subjecting two molecules of bis(3,5-dimethyl-4-hydroxyphenyl) methane to dehydration-condensation under oxidizing conditions, an epoxy resin prepared by epoxidating TKXE obtained by the method and an epoxy resin composition comprising TKXE obtained by the method as a hardener and an epoxy resin as well as methods for preparing the resin and composition. The method makes it possible to prepare highly pure TKXE in the form of crystals. Moreover, the epoxy resin and the epoxy resin composition can provide hardened products excellent in physical properties such as heat resistance and mechanical strength.

Epoxy resin derived from the highly pure compound and method for

A surgical filament which has a surface coated with at least one N-long chain monoacylated basic amino acid having an aliphatic acyl group of from 6 to 22 carbon atoms or with a composition containing at least one of said N-long chain monoacylated basic amino acid, and has improved surface-slipping characteristics such as the ability to be passed through tissue and tie down property.

Surgical filament

Preparation process of bisphenol A

A biocompatible polyester which has improved hydrolyzability obtained by bonding saccharide to the structure of a polymer consisting of a glycolic acid unit and/or a lactic acid unit, and a process for Preparing the biocompatible polyester are disclosed.

Growing community of inventors

Aichi, Japan

Shigeru Iimuro