Canon Kabushiki Kaisha

Kabushiki Kaisha Shinkawa

Sony Corporation

Shigeru Ichikawa

Osamu Nakamura

Tsuneharu Arai

Satoshi Suzuki

Masachika Sasaki

An image sensor provided with an imaging unit including a plurality of photoelectric converters, the image sensor comprises: an input unit to which image data is input from outside of the image sensor; an image processor that applies image processing to image data obtained from the imaging unit and to the image data input from the input unit; and an output unit for outputting, to the outside, image data obtained through the image processing by the image processor.

Image sensor and image capturing apparatus

An image-pickup apparatus includes an exposure condition calculator configured to calculate an exposure condition of an image sensor determined by accumulation time of the image sensor, an amplification amount and an aperture value of an image signal, and an image generator configured to generate a high dynamic range image. When the plurality of exposure conditions have equal exposure differences, the exposure condition calculator changes the accumulation time so as to follow a change of the object brightness from a first value to a second value, and the exposure condition calculator calculates the plurality of exposure conditions by fixing the accumulation time and by changing the amplification amount so as to follow a change of the object brightness from a third value smaller than the first value to a fourth value smaller than the second value.

Image-pickup apparatus, control method for the same, and non-transitory computer-readable storage medium

There is provided an image capturing apparatus. An image capturing control unit performs image capturing using a first pixel group of an image capturing unit during a first exposure time to obtain a high-exposure image. It also performs image capturing using a second pixel group of the image capturing unit during a second exposure time which is shorter than the first exposure time to obtain a first low-exposure image. It also performs image capturing using the second pixel group during a third exposure time which is shorter than the first exposure time to obtain a second low-exposure image. The second and third exposure times at least partially overlapping the first exposure time. A detection unit compares the first low-exposure image with the second low-exposure image to detect a motion of the subject.

Image capturing apparatus obtaining high-exposure and low-exposure images, and method for controlling the same

An image sensor in which one unit structure includes a plurality of photo-electric conversion units, a floating diffusion, a plurality of transfer transistors which are arranged in correspondence with the plurality of photo-electric conversion units so as to transfer charges respectively converted by the plurality of photo-electric conversion units to the floating diffusion, a source-follower amplifier which outputs a voltage signal according to a charge amount of the floating diffusion, and a reset transistor which resets the plurality of photo-electric conversion units and the floating diffusion, and a plurality of unit structures are two-dimensionally arranged in a row direction and a column direction, the image sensor comprising a control unit which divides the plurality of unit structures into a plurality of groups, and controls the transfer transistors for each divided group.

Image sensor with transfer transistors whose on periods are controlled by timing signals based on transistor transfer efficiencies

Provided is an information processing apparatus including a storage part for storing criteria information of a plurality of destinations, and a display control part for performing control to display transmission capability information indicating whether it is possible to transmit, to each of the destinations, a selected motion picture file in a predetermined range selected from a motion picture file by a user, the transmission capability information being derived based on information about the selected motion picture file and the criteria information.

Selective transmission of motion picture files

A defect pixel detection apparatus includes an image sensor which includes an effective pixel configured to have a photoelectric conversion element and an output unit configured to output a pixel signal generated by the photoelectric conversion element, a first reference pixel configured to have the same pixel configuration as the effective pixel and be optically shielded, and a second reference pixel configured to have a pixel configuration different from that of the effective pixel, a defect level acquiring unit configured to acquire a defect level of a target pixel in the image sensor, and a defect pixel determination unit configured to determine whether the target pixel is a defect pixel by comparing a defect level of the target pixel with a defect detection threshold according to a type of the pixel.

Defect pixel detection apparatus and method for detecting defect pixel

A device for conveying a wafer ring between a wafer ring container and a pellet pick-up device. A pair of guide rails which guide both side edges of a wafer ring that is conveyed by a wafer ring conveying assembly are installed pivotally in a vertical direction near the wafer ring cassette. The guide rails are pivoted so as to take a horizontal position when the conveying of the wafer ring is performed and take a vertical position when the pellet pick-up device is in operation. Thus, the operation of the pellet pick-up device is not hindered by the guide rails.

Wafer ring supply and return device

A bonding tool used in a bonding apparatus for bonding, for example, pellet and leads of a lead frame including a tool attachment part to which a tool member is mounted. The tool member has four inclined surfaces, and the tool attachment part includes two fixed guide members and two detachable guide members fastened to the tool attachment part by bolts. Inclined surfaces that position two adjacent inclined surfaces of the tool member are formed on the fixed guide members, and inclined surfaces that position the other two inclined surfaces of the tool member are formed on the detachable guide members. The tool member is mounted on and dismounted from the tool attachment part by merely removing the detachable guide members.

Bonding tool

A device for conveying a wafer ring between a wafer ring container and a pellet pick-up device. The wafer ring having a wafer sheet with semiconductor pellets adhered on it is held at its one end by a pair of claws that is equipped with a sensor for detecting the wafer ring held by the claws. After determining the presence of the wafer ring held by the pair of claws, the claws carry the wafer ring onto the pellet pick-up device and then carries the wafer ring back to the wafer ring container. The sensor can be installed on either one of the pair of the claws.

Method and apparatus for removing a chip from a bonding stage of a bonding machine via a vacuum suction of a collet upon exceeding a predetermined heating time so as to avoid thermal damage of the chip. The collet which vacuum-chucks the chip is moved vertically and then circularly by means of a combination of a drive shaft, a cam follower and a cylindrical cam holder so that the vacuum-chucked chip can be returned to the bonding stage or be transferred to other places.

Chip bonding method and apparatus

An apparatus for carrying a magazine for lead frames used in, for example, a wire bonding machine including a magazine loader stage, a magazine unloader stage, and a vertically moving elevator that carries the magazine from the loader stage to the unloader stage, and the elevator is provided with a chucking device that securely hold the magazine in the elevator so that the magazine in the elevator is prevented from moving around.

Growing community of inventors

Tokyo, Japan

Shigeru Ichikawa