Olympus Corporation

Olympus Optical Company, Ltd.

Shigeru Hosokai

Hiroyuki Motohara

Yoshio Hagihara

Yuichi Gomi

Seisuke Matsuda

Hiroshi Itoh

Satoru Adachi

Shinichi Nakajima

Tsutomu Nakamura

Daichi Kodama

Kenji Miyata

Tetsuo Nomoto

Takuro Horibe

Kenjiro Kanno

Sumio Wakito

Masayoshi Miura

A holding frame for an imaging unit arranged at a distal end of an endoscope includes a cylindrical three-dimensional molded interconnect device; a housing configured to house the imaging unit, the housing being formed of a notch; at least one cut face formed on the side face of the holding frame and obtained by cutting a support portion which is a gate portion into which a resin is injected when the holding frame is resin-molded; a connection terminal formed on a bottom face of the housing portion and configured to be connected to the imaging unit; a cable connection electrode arranged on a face where a proximal end side of the holding frame is notched; and a wiring pattern formed on a surface area of the holding frame excluding the cut face and configured to electrically connect the connection terminal and the cable connection electrode.

Holding frame, endoscope distal end structure, and endoscope

An endoscope distal end structure includes: an imager, a distal end frame that is a three-dimensional molded interconnect device including a housing portion and a cable connecting portion, the cable connecting portion including a cable connection electrode, the housing portion being formed by cutting out at least a part of an outer peripheral portion of the distal end frame, the housing portion having a bottom surface on which connection terminals are formed, and a first side surface and a second side surface which are continuous to each other and on which a ground pattern is formed, a through hole having electrical conductivity, the through hole penetrating from the bottom surface to the cable connecting portion, and an electrical conductive pattern connecting a cable connection electrode and the ground pattern, the electrical conductive pattern being arranged on a side surface of the distal end frame.

Endoscope distal end structure and endoscope

An endoscope distal end structure includes: an imaging unit; a signal cable; and a distal end frame including a housing portion, and a cable connection portion configured to connect the signal cable. The housing portion is a recess formed on a distal end side of the distal end frame. The housing portion includes a side surface and a bottom surface provided with a connection terminal. At least a part of the cable connection portion is provided with a cable connection electrode that connects a core wire of the signal cable on a distal end side from a bottom surface of the housing portion with reference to the optical axis direction of the imaging unit. The connection terminal and the cable connection electrode are connected by a wiring pattern formed in the housing portion, an outer periphery of the distal end frame, and the cable connection portion.

An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

Endoscope, distal end barrel member of endoscope and insertion portion of endoscope

A pixel portion of an image pick-up device having a pixel portion of pixels arranged in matrix converting a subject image to an electric signal, and a scanning unit of sub-scanning circuits outputting a video signal, a first scanning circuit selecting a pixel position in a first matrix direction and a second scanning circuit selecting a pixel position in a second direction intersecting the first direction. One of the first and second scanning circuits shares the signal lines. The image pick-up device includes a scanning control circuit controlling the first and second scanning circuits. The pixel area structures of the pickup device are uniform, the wirings are uniform, and the vertical and horizontal driving systems and an output system are uniform. Thus, pixel signals outputted from two output systems have no property differences and image quality is improved.

Image pick-up device

An image pick-up apparatus includes an image pick-up device and a filter circuit. The image pick-up device includes a pixel portion for converting a subject image into an electric signal, a scanning circuit for dividing the pixel portion into a plurality of areas, for non-linearly dividing the boundary of the areas of at least one side of the adjacent areas based on the unit of pixel, and a plurality of output circuits for individually outputting video signals. The filter circuit performs filter processing of the video signals outputted from the plurality of output circuits for the pixels near the boundary of the areas. Thus, the image quality can be improved in the multi-channel output system.

Image pick-up apparatus

Disclosed herein is a package of solid-state imaging device for enclosing the solid-state imaging device having a plurality of signal output pads for outputting image signals, provided correspondingly to each of a plurality of image outputs, including: a plurality of inner leads for effecting electrical connection with each of the plurality of signal output pads of the solid-state imaging device; a plurality of lead frames each having a same configuration with another, formed correspondingly to each of the plurality of inner leads as continuation therefrom; and a plurality of electrical connection means formed as continuously connected to each of the plurality of lead frames.

Package of solid-state imaging device

A solid-state image pickup apparatus having over solid-state image pickup device chip a hermetic seal portion comprising a flat-plate portion of a transparent member and a frame portion formed on a side portion of a lower surface of the flat-plate portion, said frame portion including a metal wiring, a bump formed on said solid-state image pickup device chip and electrically connected to the metal wiring, and a sealing region for sealing the periphery of the bump by a sealing material, thereby achieving the solid-state image pickup apparatus capable of being packaged in a relatively small size and capable of improving throughput and at the same time having a hermetic seal portion which can be readily electrically connected to an external terminal.

Solid-state image pickup apparatus having a hermetic seal portion and fabricating method thereof

An XY-address solid-state image pickup apparatus comprises a pixel array made up a plurality of pixels two-dimensionally arranged and horizontal and vertical scanning circuits for reading the signal from the pixel array. Each scanning circuit comprises a plurality of unit stages cascaded, each unit stage comprising a plurality of first shift register units cascaded and a single second shift register unit which is associated with the plurality of first shift register units and which is driven by a clock different from the clock that drives the plurality of first shift register units. Each unit stage further comprises a first switch and a second switch. The input to the first unit of the first shift register units is also fed to the second shift register unit via the first switch. The output of the second shift register unit is fed to each of the plurality of first register units within the unit stage via the second switch. Each scanning circuit further comprises driving means for turning on/off the first and second switches in order to switch between a normal scanning and a thinned-out scanning.

Growing community of inventors

Hachioji, Japan

Shigeru Hosokai