Hitachi-kokusai Electric Inc.

Shigeru Honda

Naoya Miyashita

Akihito Watanabe

Katsumi Takashima

Provided is a substrate processing apparatus capable of improving the workability of measuring a temperature-flat zone in a process furnace and the reliability of a temperature-flat length of a heater. The substrate processing apparatus includes a process chamber configured to process a substrate retained in a retainer loaded therein; a temperature measuring device configured to measure an inside temperature of the process chamber; a transfer device configured to transfer the substrate at least to the retainer; and a controller configured to control the transfer device and the temperature measuring device to move the transfer device to a predetermined position before the inside temperature of the process chamber is measured and to obtain the inside temperature by the temperature measuring device while vertically moving the transfer device with the temperature measuring device attached to the transfer device when the inside temperature of the process chamber is measured.

Substrate processing apparatus, method of measuring temperature of substrate processing apparatus and non-transitory computer-readable recording medium

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Toyama, Japan

Shigeru Honda