Rohm Co., Ltd.

Towa Corporation

Shigeru Hirata

Yasumasa Kasuya

Hiroaki Matsubara

Toshio Nakajima

Yuji Ishimatsu

Masanori Tsuchihashi

Hiroshi Kumano

Kazuhiro Murakami

Akira Hashimoto

Yasunobu Inoue

Motoya Kumagai

Yoshifumi Shigmogaki

Toshinobu Banjo

Masanori Shirasawa

Yusuke Kuramitsu

The present disclosure provides a motor control device that realizes a drive signal for each phase in a three-phase modulation control system with an analog circuit. The motor control device includes a generator, a modulation unit and inverting unit. The generator is configured to receive an input voltage and generate an analog voltage having a crest value corresponding to the input voltage and having a reference potential or higher. The modulation unit is configured to generate a PWM voltage based on the analog voltage output from the generation unit. The inverting unit is configured to invert a duty in a predetermined period of the PWM voltage.

Motor control device, motor drive device, motor system, and electrical apparatus

A semiconductor device includes a first lead having a base extending in a first direction, and an IC on the base. The semiconductor device also includes a second lead, a third lead and fourth leads. The second lead includes a first belt-like section on one side of the base in the first direction, extending in a second direction, and paired second belt-like sections extending in the first direction from the first belt-like section. The third lead is on one side in the first direction. The fourth leads are on one side of the third lead in the first direction. First switching elements are bonded to the third lead. Second switching elements are respectively bonded to the fourth leads. The base overlaps with the first belt-like sectionwhen viewed in the first direction. At least a part of the base is between the second belt-like sections.

Semiconductor device

Packaged semiconductor module

A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Power module and motor drive circuit

A semiconductor device has a supply pad to which a supply voltage is fed, a supply conductor that is electrically connected to the supply pad, an input/output pad via which a signal is fed in from outside or fed out to outside, an electrostatic protection device that is electrically connected to the input/output pad and that is electrically connected via the supply conductor to the supply pad, and an internal circuit that is electrically connected via a signal conductor to the input/output pad. The electrostatic protection device, the input/output pad, and the internal circuit are arranged in this order from edge to center of the semiconductor device.

Semiconductor device with electrostatic discharge protection device near the edge of the chip

A motor driving device includes a clock oscillator configured to generate a clock signal; and a logic unit configured to receive the clock signal, control conduction of a 3-phase brushless direct current (DC) motor, and generate a revolutions per minute (RPM) detection signal. The clock oscillator is configured to switch an oscillation frequency of the clock signal depending on an RPM command signal input to set a target RPM of the 3-phase brushless DC motor.

Motor driving device

A rotation speed detection circuit includes an internal clock generation portion which receives an input of a period signal whose period varies in accordance with rotation speed of a motor and generates an internal clock signal having a predetermined number of pulses in one period of the period signal, and an internal clock counter portion which counts the number of pulses of the internal clock signal for a predetermined period every one period of the period signal and delivers a count value thereof as a digital data signal.

Rotation speed detection circuit and motor driver apparatus having the same

In an overcurrent protection circuitaccording to the present invention, a timer circuit TMR that generates an overcurrent protection signal EN according to the results of comparison between a detection voltage Va (Vb) and VrefL and VrefH is configured as follows. When Va (Vb) has reached VrefL, the timer circuit TMR starts to count T. When Thas elapsed with Va (Vb) kept above VrefL, the timer circuit TMR changes EN to a disabled state and starts to count T. When Thas elapsed, the timer circuit TMR returns EN to an enabled state. On the other hand, after Va (Vb) has reached VrefL and Tstarts to be counted, when Va (Vb) has reached VrefH, the timer circuit TMR forcibly stops the counting of Twithout waiting for Tto elapse, changes EN to a disabled state, and starts to count T. With this configuration, it is possible to offer necessary and sufficient protection for an object to be protected (for example, a load or an element provided inside a device).

Overcurrent protection circuit, load driving device, motor driving device, electric appliance, power supply device

A motor drive device of the present invention includes: an output circuit provided with a switch element connected to a motor; a PWM signal generating circuit for generating a PWM signal having a duty corresponding to a ratio between a power supply voltage applied to the motor and a predetermined control voltage; a control circuit for performing on/off control of the switch element according to the PWM signal; and a control voltage generating circuit for generating the control voltage such that the back electromotive voltage of the motor is maintained at a desired value.

Motor drive device and electric apparatus using the same

A motor drive device comprising an H-bridge circuit having four switching elements connected in an H bridge form to a motor coil L, a control circuit for on-off controlling each switching element, and a PWM signal generating circuit for generating a PWM signal having a duty according to a ration between a power supply voltage Vcc and a control voltage Vref, wherein the control circuit is so constituted as to select a switching element to be turned on according to an operation mode control signal FIN, RIN and control its on-duty according to the PWM signal. This constitution can variably control easily and over a wide range a drive voltage applied to one end of the motor coil L according to an externally input control voltage Vref.

Motor drive device and electric equipment using this

A semiconductor device comprising an internal current generating section () for supplying an output current (i) dependent on an input current (i) into an IC, an external terminal () for connecting an external resistor (Rex) to the input end side of the internal current generating section (), a current limiting element () connoted between the input end of the internal current generating section () and the external terminal (), a first current limiting section () for pulling in the input current (i) when one end voltage VA of the current limiting element () is higher than a first threshold voltage VB, and a second current limiting section () for pulling in the input current (i) when the terminal voltage VC of the external terminal () is higher than a second threshold voltage. System down can be avoided by operating the internal circuit surely regardless of the state of the external terminal.

Semiconductor device with internal current generating section

A temperature protective circuit of the semiconductor integrated circuit unit of the present invention is configured such that the circuit includes a heat generation detecting section for detecting a monitored temperature and a limiting signal producing section for limiting continuously or stepwise the drive of a load (for example, the upper limit of drive current) according to the above-mentioned monitored temperature, after the above-mentioned monitored temperature exceeds a first threshold temperature, based on the detection results of the above-mentioned heat generation detecting section. With such a configuration, an abnormal heat generation of a subject of overheat monitoring can be previously limited to perform a more safely temperature protective operation.

Semiconductor integrated-circuit unit with temperature protective circuit

A resin molding apparatus includes a fixing member to which a top mold is attached, a movable member to which a bottom mold is attached, a push-up member provided below the movable member, a drive mechanism moving the push-up member in upward/downward direction, and a flexible joint provided between the movable member and the push-up member. The push-up force of the drive mechanism is transmitted from the push-up member via the flexible joint to the movable member. Thus, a crack does not occur at a connection portion between the push-up member and the movable member. Therefore, a gap is not created between the top mold and the bottom mold. As a result, an excellent molded product is formed.

Growing community of inventors

Kyoto, Japan

Shigeru Hirata