Toyota Jidosha Kabushiki Kaisha

Matsuo Industries, Inc.

Shigeru Hayashida

Takahiro Hirano

Takuya Kadoguchi

Toru Takahashi

Hironao Hayashi

Yoshikazu Suzuki

Tomokiyo Suzuki

Yuki Yamakawa

Kensuke Nakanishi

Iori Kobayashi

Osamu Kuriyagawa

Yuuji Hanaki

Masanori Sumida

Akira Ishimaru

A manufacturing method of a semiconductor module includes: sealing an assembly with resin, the assembly including a semiconductor chip, a heat-dissipation plate on the semiconductor chip, and multiple terminals, such that the resin includes a first surface, a second surface located opposite to the first surface, and a side surface, a groove extends in the side surface from the first surface to the second surface, an inner surface of the groove includes a first tapered surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface; and cutting the first surface within an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface such that the heat-dissipation plate exposes.

Method of fabricating a semiconductor module with a inclined groove formed in resin side surface

A case with a connector integrally formed with a resin connector, and can be manufactured with a small number of processes is provided. The connector case includes a housing, a resin connector, and a ground terminal extending along an outer periphery of the connector. A terminal-side fixing portion extending backward from the ground terminal is crimped to or pressed over a housing-side fixing portion. When molds are closed after the housing and the ground terminal are placed in the molds for injection molding of the resin connector, a pressing portion formed on the mold presses the terminal-side fixing portion against the housing-side fixing portion to crimp or press the terminal-side fixing portion to or over the housing-side fixing portion. As a result, in the process for the injection molding of the connector, the ground terminal is fixed to the housing at the same time. The connector case with the ground terminal fixed to the housing can be manufactured in a small number of processes.

Case with connector and manufacturing method thereof

Growing community of inventors

Toyota, Japan

Shigeru Hayashida