Tdk Corporation

Other

Nof Corporation

Shigeru Asami

Kazuo Takahashi

Kenryo Namba

Akihiko Kuroiwa

Toshiki Aoi

Hideaki Shimoda

Hitoyoshi Kurata

Eriko Ajioka

Hiroshi Ikeda

Yoshinari Yamashita

Toshiaki Yamada

Takeshi Takahashi

Kenichi Kawabata

Mamoru Usami

Shuichi Takizawa

Kenji Endou

Hiroki Hara

Hiroshi Hotta

Seiichi Tajima

Noriko Takeda

Masumi Kameda

Michihisa Yamada

Yoshiyuki Yasukawa

Yasuo Moriya

Teruaki Sugahara

Toshihiro Ohta

Tomiho Yamada

An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Electronic circuit module component and method of manufacturing electronic circuit module component

A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar &#x3b1;-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar &#x3b1;-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

Prepreg and conductive layer-laminated substrate for printed wiring board

An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substratethat is formed with a first transmission lineand a high-frequency devicethat is mounted on the first dielectric substrateand is connected to the first transmission lineThe antenna-side module B is equipped with a second dielectric substratethat is laid on the first dielectric substratein such a manner that they are arranged in a lamination direction and that is formed with a second transmission linethat is electrically connected to the first transmission lineand an antenna elementthat is provided on the second dielectric substrateand electrically connected to the high-frequency devicevia the second transmission lineand the first transmission line

Electronic component module and manufacturing method thereof

An electronic component module according to the invention includes: a mounting substrateincluding a shield layerand on which a first cavityand a second cavityare formed; a first electronic componentpositioned in the first cavityand used in a first frequency band; a second electronic componentpositioned in the second cavityand used in a second frequency band; lid memberswhich seal the first cavityand the second cavity; and patch antennaswhich transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components; wherein the electronic componentsare mounted on the mounting substratevia a substrate componenthaving a higher heat resistance than the mounting substrateand that the mounting substrateis composed of a member having a lower dielectric constant that the substrate component

Electronic component module

An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.

An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.

Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.

Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it

The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the same

An optical recording medium comprising a pair of substrates each having an electrode, the space between the substrate is filled with a high-dielectric liquid crystal to form a rewritable recording layer. The recording medium comprises radiation absorbing means to provide a change of directional orientation of the liquid crystal upon exposure to a laser beam.

Optical recording medium having a liquid crystal layer

An optical recording disk wherein information is written and reproduced through the application of recording and reading laser beams is assembled by preparing a pair of circular substrates which each are provided with a plurality of studs or spikes on outer and/or inner circumferential band, forming a recording layer of dye on each substrate, and joining the substrates together through the studs by ultrasonic sealing or adhesive bonding such that the recording layers face one another via an interior space.

Growing community of inventors

Tokyo, Japan

Shigeru Asami