Tokyo Electron Limited

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Yamanashi Limited

Shigeoki Mori

Wataru Karasawa

Keiichi Yokota

Masaru Suzuki

Hitoshi Fujihara

A device for examining the electrode pads of a semiconductor chip comprises a table for supporting a semiconductor wafer including chips each having two lines being substantially straight and consisting of a plurality of electrode pads, a probe card having two lines corresponding to the lines of the electrode pads, and consisting of a plurality of probes, first and second TV cameras for photographing the lines of the electrode pads and probes, and a control unit responsive to signals supplied from the cameras, for calculating first imaginary lines corresponding to the lines of the electrode pads and second imaginary lines corresponding to the lines of the probes, and for recognizing deviation between the first and second imaginary lines. The table is moved by the deviation so as to align the lines of the pads with those of the probes.

Probe device

A contact ring having probe pins is mounted in the top surface of a casing, and a wafer holder table is placed below the contact ring. A holder member comprising a longitudinally extended cylindrical body are provided in such a manner as to be free to move into and out of a space between the probe pins and the wafer holder table, parallel to the upper surface of a wafer and along guide rails protruding from a casing. An image of the probe pins which act as contact means and an image of the electrode pads of an IC chip on the wafer are input to a camera that is provided in the holder member. With the probe apparatus of the present invention, it is possible to position the wafer while viewing these images, and there is no need to provide a region for separate positioning. This facilitates the design of a smaller probe apparatus.

Probe apparatus for measuring electrical characteristics of objects

A probe apparatus which has a probe card having a plurality of probes, a wafer holder located above or beside the probe card, for holding a wafer to be examined, a tester head electrically connected to the probes of the probe card, a tester electrically connected to the tester head, for detecting electrical characteristics of the wafer from the data output from the wafer, and a CCD camera arranged to oppose the object, for detecting the position of the wafer.

Probe apparatus with a swinging holder for an object of examination

A probe apparatus having a probe card having plurality of probes, a member arranged above the probe card to hold an object to be probed, and a test head electrically connected to the probes of the probe card.

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Ayase, Japan

Shigeoki Mori