Seiko Epson Corporation

Shigeo Toda

Hiromi Saito

Yasunori Ogawa

Nobuo Watanabe

The present invention provides a high quality electronic optical device by preventing flaws and dust from adhering on substrates, between which a liquid crystal is inserted, and by suppressing a temperature increase caused by irradiation of light from a light source. The present invention also provides a projection type device using the electronic optical device and a method for producing the electronic optical device. Flaws and dust are never adhered on an outer face of an active matrix substrate because a planar surface of a third substrate is adhered with an adhesive on the outer face of the active matrix substrate in the electronic optical device. Even when flaws and dust are adhered on an outer face of the third substrate, such flaws and dust are not displayed on the projection image. Forming a light-shielding film on the third substrate allows the design margin of a case to be enlarged.

Electronic optical device and method for producing the same, and projection type display device

An optical modulation device is presented having a distance Wp from the end of an opposite substrate to the inner peripheral edge of a cover portion in a frame being set to be smaller than the distance W from the end of the opposite substrate to the inner peripheral edge of a first light-shielding portion (Wp<W ). Therefore, there is no fear that incident light from outside of the inner peripheral edge of the cover portion may be blocked by the cover portion, so that incident light may reliably enter the entire image area. This arrangement makes it possible to prevent the peripheral portion of a projection image from becoming dark, and thereby improve the quality of the projection image.

Optical modulation device and projector

A solid state image sensing device including a transparent support, at least one transparent substrate chip fixed on the support by a fixing agent, at least one photoelectric converting element on the transparent substrate chip and mold material for covering at least the exposed surfaces of the transparent substrate chip, in which the refractive index of the mold material is higher than or equal to that of the transparent substrate chip. The transparent substrate chips can be arranged in a line which is equal in optical and electrical continuity to a single-line solid state image sensing device of high precision and reliability.

Growing community of inventors

Chino, Japan

Shigeo Toda