Somar Corporation

Shigeo Sumi

Fumio Hamamura

Mitsuhiro Seki

Takao Matsuo

Yasuhiro Nagafuchi

Ichio Fukuda

Takashi Goto

Yoji Washizaki

Kenji Kitagawa

Noriyasu Sawada

It is an object of the invention to provide film peeling method and device which, when a circuit board with laminated thin films coated on the front and back surfaces thereof is beaten by vibrator rods from the front and back sides thereof to thereby peel the film, can absorb variations in the coated positions of the front and back laminated thin films and also prevent the vibrator rods from being damaged when they beat each other idly. Vibrators 16A, 16B are disposed on the front and back sides of a circuit board 14 with laminated thin films 12A, 12B coated on the front and back surfaces thereof, back and front back-up rollers 24B, 24A are disposed at positions respectively opposed to the front and back rods 18A, 18B of the vibrators 16A, 16B, and the back and front back-up rollers 24B, 24A are moved synchronously with the front and back rods 18A, 18B, respectively.

Method and device for peeling a film

A film peeling apparatus is disclosed wherein a base plate stuck with the films is conveyed to a film peeling position, where a contact tightness of leading edges of the films to the base plate is reduced by a film contact tightness reducer while relative moving speed of the base plate and the reducer is decreased by slowing down the conveyance speed of the base plate or by moving the reducer in synchronism with the conveyance of the base plate without stopping the conveyance of the base plate.

Film peeling method and apparatus for practicing same

An apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.

Apparatus for bonding continuous thin film to discrete base plates and

Film remover

A base plate conveyor for conveying a base plate in a film adhering and peeling apparatus. The conveyor include a plurality of rollers which are capable of conveying the base plate between processing members disposed on opposite sides of the base plate. The base plate is capable of being positioned such that the center of the base plate coincides with the center point between the processing units, regardless of the thickness of the base plate. The conveyor further includes a mechanism for adjusting the transverse position of the base plate with respect to the direction of conveyance thereof. Also provided is a mechanism for applying an air bubble preventive agent to the base place such that air bubbles do not form between the base plate and the film adhered thereto.

Base plate conveyor

A conveying mechanism, particularly useful with a printed-circuit board laminator, in which the board is conveyed by several conveyor rollers having a small gap against several guide members, such as rollers, to accommodate the board and prevent its warping. A sliding device aligns the board as it is transported by the rollers.

Apparatus for conveying base with crosswise base sliding device

A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.

A thin film laminating apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure laminating roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film laminating apparatus.

Adjustable film cutoff unit

A film guide device for film bonding in which a movable guide roller support and guides the film and swing roller arms prevent the slackening of the film while the film is being fed. Also, a driving action of a rotation-drive source, which controls the movement of the movable guide roller support arms, is synchronized with the braking of the film supply role and the movement of the leading edge of the film towards the bonding surface. This device prevents longitudinal wrinkles in the film, misplacement on the bonding surface, and excessive tension on the film.

Film guide device for a film bonding apparatus

A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.

Thin film bonding method employing a structure for removing wetting

An apparatus for bonding a multi-layer thin film onto a substrate and for removing a layer of the film. A printed circuit board having a multi-layer film bonded to a planar surface thereof has one layer of the film lifted at a leading edge by vibration and fluid pressure. The leading edge is mechanically gripped and a pulling force applied thereto to draw the film from the surface of the circuit board and to transfer the removed film along a path to a discharge apparatus. The transfer apparatus includes frictionally engaged belts which direct the film along a transfer path to a source of ionized fluid which is applied to the film in order to remove static and direct the film along the transfer path towards a used film receptacle.

Method of peeling a bonded film from a circuit board

A base plate conveyor for supplying a base plate storage section at one end of a base plate conveyance passage to the conveyance surface of the passage or receiving the base plate from the passage to the storage section. The conveyor is characterized by including the base plate storage section in which a plurality of base plates can be piled so that the base plates are leant against the inside of the section and the conveyed surface of the base plates have a predetermined angle to the conveyance surface of the conveyance passage; and a base plate mover provided at the casing of the conveyor so as to automatically move the base plate from the storage section to the conveyance passage or from the conveyance passage to the storage section. The base plate mover includes a vertically swung arm member, which is swung vertically and translated so as to move the base plate between the base plate storage section and the base plate conveyance passage. The arm member is provided with a suction so as to suck the conveyed surface of the base plate by vacuum action. The base storage section is mounted on a carrying stand which is independently movable and is removably attached to the base plate conveyor.

The apparatus for bonding a film, having a length corresponding to the length of a board, to a film bonding surface of the board by compression bonding rollers which comprises a conveying device for conveying the board, a board clamp and guide device for clamping and guiding said board at a predetermined position, a film feed member for holding the leading end of the film by suction and feeding the leading end of the film to a film bonding position, a film leading end-holding member provided in the vicinity of the film bonding position, and having a holding surface for face-to-face contact with the leading end of the film fed by the film feed member to the film bonding position, the film leading end-holding member having film suction apertures connected to a vacuum system so as to cause the leading end of the film to be held on the holding surface by suction, compression bonding rollers for bonding the film, held at the film bonding position by the film feed member, from its leading toward trailing end to the film bonding surface of the board from the leading end to trailing end of the board, and a cutting device for cutting the continuous film at its trailing side into a length corresponding to the length of the board in the direction of feed thereof.

Film bonding method and apparatus for performing same

A thin film peeling apparatus in which a portion of a thin film adhered to a base plate is initially lifted and subsequently peeled therefrom. The film peeling apparatus includes a conveying device for conveying the base plate along a base plate conveyance path, a first thin film conveyance device for conveying the lifted portion of the thin film and a second thin film conveyance device for subsequently conveying the thin film. The first thin film conveyance device is disposed so that the thin film is peeled in a direction substantially perpendicular to the direction of conveyance of the base plate. The second thin film conveyance device includes at least one fluid ejector for ejecting fluid against the thin film such that the thin film is conveyed in a direction parallel to the surface of the base plate and substantially perpendicular to the direction of conveyance of the base plate.

Growing community of inventors

Saitama, Japan

Shigeo Sumi