Hitachi Chemical Company, Ltd.

Pacific Industrial Company, Ltd.

Shigeo Sase

Nozomu Takano

Tomio Fukuda

Michitoshi Arata

Yasuyuki Mizuno

Susumu Konii

Masatoshi Yoshida

Harumi Negishi

Takeshi Sugimura

Shoei Kuroda

Takeshi Sumi

Akira Momose

Naoki Hara

Satoshi Morita

A tire condition monitor device includes a circuit board mounted on a tire wheel for detecting a pneumatic pressure in an interior of a tire. The circuit board is covered with urethane resin. The urethane resin has finer resin meshes as compared with the conventional silicon resin serving as a board protecting resin. Since sulfur gas and water is hard to permeate through the urethane resin, gas barrier and dampproof properties can be improved. In a method of manufacturing the tire condition monitor device, a prebaking process is carried out before a board protecting process of covering the circuit board with the urethane resin. Since moisture contained in the circuit board is vaporized, the circuit board covered with the urethane resin can reliably be protected from moisture.

Tire condition monitor device and method of manufacturing the same

Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.

Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances

Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances

Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards

METHOD OF MAKING VARNISH OF MODIFIED CYANATE ESTER GROUP CURABLE RESIN COMPOSITION, AND PREPREG, METAL CLAD LAMINATED BOARD, FILM, PRINTED CIRCUIT BOARD, AND MULTILAYERED CIRCUIT BOARD USING THE COMPOSITION

An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retardant, and (d) a curing accelerator, and a laminate for printed wiring boards which has a low hygroscopicity, a high heat resistance, good high-temperature characteristics, a high resistance against electrolytic corrosion, a high resistance against color change due to heating, and a high Tg.

Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole

To provide an epoxy resin composition for printed circuit boards which demonstrates little tendency to absorb moisture, high heat-resistance, favorable high temperature properties, resistance to metal migration, favorable anti-fade property at high temperatures, high Tg, high electric insulating performance and resistance against peeling of the copper foil when formed into a printed circuit board, there is provided epoxy resin composition for printed circuit boards, comprising: (a) epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; (b) a condensation product of bisphenol A and formaldehyde; (c) a flame retardant; (d) a curing agent; (e) one or both of a phenol antioxidant and an organic sulfur compound antioxidant; and (f) a urea derivative. This composition is highly suitable as a material for manufacturing epoxy resin prepreg in general and printed circuit boards.

Epoxy composition for printed circuit boards

A modified cyanate ester group curable resin composition, and varnishes, prepregs, laminated boards adhered with metal foil, films, printed circuit boards, and multilayered circuit boards using the same, comprising: (A) a cyanate ester group compound

Modified cyanate ester group curable resin composition and varnish,

A novel process for preparing foundry cores or molds and binder materials used therefor are provided. The binder materials comprise (a) an alcohol-soluble phenolic resin, (b) a polyvalent metal hydroxide and/or oxide, (c) water, (d) an organic solvent, and (e) an alkali metal hydroxide. They are admixed with refractory particles, such as sand, and cured with carbon dioxide to form shaped foundry cores or molds. The process and materials of the invention bring about such advantages that curing may be performed with safe carbon dioxide, that shaped foundry cores or molds may be taken out from pattern immediately after curing, and that the products have a superior collapsibility after pouring a molten metal.

Process for preparing foundry cores or molds and binder materials used

Growing community of inventors

Shimodate, Japan

Shigeo Sase