Sharp Kabushiki Kaisha Corporation

Shigeo Nakabu

Takashi Nukii

Yasunobu Tagusa

Hisao Kawaguchi

Masaru Iwasaki

Katunobu Awane

Hiroshi Nakatani

Hirokazu Yoshida

Keiji Yamamura

Katsunobu Awane

Yuji Matsuda

There is provided a highly reliable panel assembly structure capable of performing fine-pitch high-density assembling at a high yield and a low cost. A flexible wiring board has a film-like substrate with flexibility, and an IC chip is mounted in an area. In the area is provided a through hole that has plane dimensions smaller than plane dimensions of the chip and penetrates the substrate. Portions that belong respectively to an output side wiring line and an input side wiring line provided on a substrate surface and are connected respectively to an output side electrode and an input side electrode of the chip via second connection materials and are supported by the substrate surface. An output terminal of the flexible wiring board is connected to an electrode terminal formed at a peripheral portion of a panel via a first connection material, while an input terminal of the flexible wiring board is connected to an electrode terminal of a circuit board via a third connection material.

Integrated circuit mounting tape

Panel assembly structure capable of connecting wiring line with

A flat type display device is assembled compactly with high reliability. The flat type display device has a liquid crystal panel having electrode terminals on a peripheral portion of one face of the liquid crystal panel, a flexible wiring board having a drive IC mounted thereon for driving the liquid crystal panel, and a common wiring board having electrode terminals on one face thereof. The flexible wiring board is electrically connected to the electrode terminals of the liquid crystal panel. The common wiring board is electrically connected to the flexible wiring board so as to transmit an input signal, which has been received by the electrode terminals from external, to the drive IC. The liquid crystal panel and the common wiring board are mounted on each other so as to overlap each other in a state that their faces on which their respective electrode terminals are provided are opposed to each other and that the electrode terminals of the common wiring board are located outside of a peripheral portion of the liquid crystal panel. The flexible wiring board is provided in a clearance between the liquid crystal panel and the common wiring board.

Assembling method of flat type display device

Flat type display device having flexible wiring board and common wiring

A liquid-crystal panel includes a plurality of thin-film transistors. Terminal electrodes associated with gate bus lines which connect the gate electrodes of the thin-film transistors include a layer that is made of an electrode material used for the gate electrode, and a transparent conductive coating formed on the layer. This structure produces a stable connection at the terminal electrode of the gate electrode providing the liquid-crystal panel with excellent display qualities and a high reliability.

Terminal electrode structure of a liquid crystal panel display

A display device that includes a substrate, a display means disposed on the substrate, a driving circuit arranged along the periphery of the substrate, wherein the driving circuit is covered with a light-shielding heat releaser on the surface thereof in opposition to the substrate.

Display device with light-shielding heat releaser

A flat matrix display panel having every side connected to an end of a flexible wiring substrate with an LSI chip loaded thereon. The flexible wiring substrate is formed into an S shape cross section by folding the substrate along an upper and a lower frames. The LSI chip is located near the center of the S-shaped substrate. The other end of the flexible wiring substrate is connected to a PC board which has other circuit components mounted thereon.

Flat display panel with framing for flexible substrate folding

A substrate for wiring an electrical component with an external circuit, comprises a base plate for accommodating the electrical component therein, a first insulation layer made of an organic material formed on the base plate, a first wiring formed on the first insulating layer, a second insulation layer made of an organic material formed on the first wiring, a second wiring formed on the second insulation layer, the second wiring being coupled to the electrical component, the base plate, the first insulation layer, the first wiring, and the second insulation layer being bent at the marginal edges thereof, in which portions of the first wiring on the bent portions are made of a material having a low temperature of recrystallization.

Metal-based organic film substrate

A substrate for wiring an electrical component in an electrical circuit comprises a base substrate, a first insulating layer of an organic material formed over the base substrate, a wiring member formed on the first insulating layer, coupled to the component, a second insulating layer of an organic material formed over the first insulating layer, and a terminal member on the first insulating layer and appearing from the second insulating layer, connected to the wiring member. A third insulating layer of an organic material may be interposed between the first and the second insulating layers, carrying a second wiring member connected to the first wiring member.

Thin assembly for wiring substrate

A display module comprises a display device for displaying visual information, an electrode disposed on the display device, a circuit board for carrying wiring lines connected to circuit elements for driving the display deivce, and a conductive elastomer body for connecting the wiring lines and the electrode, the conductive elastomer body being placed between the electrode and a curled edge a flange of the circuit board. In a specific form, the display device is a liquid crystal display cell.

Thin structure of display panel

A high-insulation adhesive sheet is formed on a metal substrate. Bottom conductors are formed on the high-insulation adhesive sheet. A high-insulation organic layer is formed on the high-insulation adhesive sheet and the bottom conductors, and top conductors are formed thereon. The high-insulation organic layer is tightly attached to the metal substrate via the high-insulation adhesive sheet. The bottom conductors and the top conductors are communicated to each other via through holes formed in the high-voltage organic layer.

Growing community of inventors

Nara, Japan

Shigeo Nakabu