Mitsubishi Materials Corporation

Mitsubishi Materials Silicon Corporation

Mitsubushi Materials Silicon Corporations

Mitsubushi Materials Corporation

Shigeo Kumabe

Shigeru Kimura

Keisuke Takahashi

Yukio Tsutsumi

Shoji Tsuruta

Masao Takada

Akihito Yanoo

Akira Kawakawaguchi

A semiconductor wafer chamfer polishing method for polishing chamfers formed on the edges of semiconductor wafers includes rotating a semiconductor wafer; pressing a polishing cloth against a chamfer of the semiconductor wafer with sufficient pressure to elastically deform the polishing cloth, while supplying polishing fluid to the chamfer; sliding the polishing cloth along an incline of the chamfer from an outer edge toward a center of the semiconductor wafer so as to form a bulge portion of the polishing cloth which contacts an outer surface of the semiconductor wafer, thereby polishing the outer surface along with the chamfer of the semiconductor wafer.

Method and apparatus for polishing chamfers of semiconductor wafers

The present invention relates to a method of cleaning wafers bonded on a fixing member in the form of an ingot, and then sliced by a wire saw from a direction perpendicular to the longitudinal dimension to form a row of wafers. The method includes: a cleaning process for cleaning the wafers bonded on the fixing member in the form of the row of wafers (workpiece W) by a cleaning mechanism; and a separating process includes: a softening step for softening an adhesive in a softening vessel; a first moving step for turning and moving a wafer in a planar direction using an end point of the glued portion of the wafer and the fixing member as the fulcrum; and a second moving step for further moving the wafer in a planar direction by a suction-cup rotary actuator to thereby bring the wafer out of the region of the row of wafers.

Method and apparatus for cleaning and separating wafers bonded to a

There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly, a first rotating mechanism for rotating the first polishing plate assembly, an upper polishing plate assembly, a second rotating mechanism for rotating the upper polishing plate assembly, a pressing mechanism, a conveying mechanism and a discharging mechanism. The lower polishing plate assembly includes a lower polishing plate, a polishing pad, a porous sheet interposed between the lower polishing plate and the polishing pad. The porous sheet has a thickness of 0.5 to 3 mm, and is formed of a foaming resin. The upper polishing plate assembly includes an upper polishing plate, a plate-like chuck and a backing pad, a pressure reducing unit, and a cleaning unit.

Apparatus for polishing wafer

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Tokyo, Japan

Shigeo Kumabe