Hitachi, Ltd.

Hitachi Construction Machinery Co., Ltd.

Donaldson Comapny, Inc.

Hitachi Koki Co., Ltd.

Hitachi Medical Corporation

Shigeo Kato

Kazuo Sato

Isao Ishikawa

Kuninori Imai

Takeji Shiokawa

Shinji Tanaka

Atsushi Kikugawa

Hiroshi Kanda

Eiichi Murakami

Yoshihisa Fujisaki

Shigeyuki Hosoki

Hajime Aoi

Ryo Imura

Fumihiko Uchida

Kiyokazu Nakagawa

Masakazu Ichikawa

Sumiko Fujisaki

Morio Tamura

Kazuyoshi Hatano

Hisayoshi Hashimoto

Yasuhide Matsumura

Harumasa Onozato

Kiyoshi Tanaka

Fujio Sato

Ken Ichiryuu

Takao Kawanuma

Osamu Morita

Sadao Matuoka

Susumu Saito

Minoru Yoshida

Hideki Kohno

Naoyuki Tamura

Sumio Okuno

Gyozo Toda

Toshio Takahashi

Yukio Takano

Muneo Mizumoto

Masahiko Ogirima

Sumio Yamaguchi

Takayuki Hayakawa

Sakae Saito

Michiyoshi Maki

Takaji Suzuki

Yota Kawabe

Toshimichi Ikeda

Shigeru Aoki

Shigeo Kubota

Kan Otake

Hajime Yao

Yutaka Kuwabara

Junich Teshigawara

Shugo Yanada

Air cleaner assemblies, features thereof and components thereof are described. Among the components described are a main filter cartridge and a safety cartridge.

Air filter cartridges, components thereof; and, air cleaner assemblies

A fine-fabrication method of solid surfaces relates to a new surface fabrication method allows a solid-device surface to be fabricated at an atomic scale so as to produce an ultra-fine device or a device for recording information at an ultra-high density. A probe is installed with a tip thereof facing to the surface of a specimen to undergo fabrication. A voltage for forming an electric field is applied between the probe and the specimen. The electric field is large enough to field-evaporate atoms constituting the specimen or the probe; the electric field field-evaporates atoms constituting the specimen, removing them from the surface of the specimen; and as another alternative, the electric field field-evaporates atoms constituting the probe, depositing them on the surface of the specimen. Further, in another surface atom fabrication method, while the surface of a specimen is observed at an atomic scale using a surface observation technique by means of a scanning tunnelling microscope, a pulsative voltage large enough for the field evaporation of atoms described above is applied between the probe and the specimen at any arbitrary desired positions on the surface of the specimen; and the pulsative voltage field-evaporates and, hence, eliminates atoms one by one from the surface of the specimen.

Surface atom fabrication method and apparatus

An ultrasonic probe comprising an acoustic lens (20) having a concave lens surface (21) formed on one side of a lens body, and a piezoelectric transducer (23) disposed on the other side of the acoustic lens, ultrasonic waves generated by applying voltage to the piezoelectric transducer being focused through the lens surface to detect the reflected waves of the ultrasonic waves from a sample (26) by the piezoelectric transducer for obtaining information about the surface or interior of the sample. The lens surface (21) of the acoustic lens (20) is defined by an etch profile (15) formed by etching a substrate material (11) which makes up the lens body.

Ultrasonic probe

Ultrasonic probe and manufacture method for same

A slide table includes an inner member, an outer member fitted at least partly over the inner member, air bearings provided between the inner and outer members, and a motor means having a coil connected to the outer member to drive the same.

Slide table

The rotating mirror light deflecting system employs a non-circular dynamic gas bearing providing dynamic pressure to radially support the shaft. The bearing is provided internally with a multiplicity of grooves or embankments whereby dynamic gas pressure is increased to enhance rigidity. The bearing radially moves as a whole with damping according to a movement of the shaft, thus permitting nondestructive movement of the shaft and absorption of the resonant energy of the shaft. The shaft and the bearing will not come in contact with each other, and oscillation energy of the shaft is absorbed or dissipated by an external viscous or hysteresis resistance of the bearing therefore resonance oscillation is attenuated on the instant it occurs. Since the resonance point is high due to bearing surface rigidity, whirling is hard to arise, however, if whirling does arise, then the bearing and the shaft move together to attenuate oscillation energy of the shaft, therefore oscillation and whirling is put down immediately.

Light deflecting system with rotating mirror

A radiation detecting apparatus includes a pair of substrates disposed face to face in such a manner that a plurality of grooves provided in one of the facing surfaces at a predetermined interval face a plurality of grooves provided in the other of the facing surfaces at the predetermined interval. Radiation shielding plates are inserted at both ends thereof into a facing pair of grooves to be held by both of the substrates, scintillators are mounted on a corresponding one of the radiation shielding plates, and photodetectors are fixed to either one of the facing surfaces of the substrates between adjacent grooves so that a plurality of facing pairs of photodetectors are juxtaposed.

Radiation detecting apparatus

An apparatus for molecular beam epitaxy according to the present invention is so constructed that a substrate is introduced into a vacuum vessel with a substrate surface for epitaxial growth facing in the direction of gravity, and that the substrate is conveyed to and transferred into vacuum chambers for performing processes necessary for the epitaxial growth, with the substrate surface maintained in the direction of gravity and without directly touching the substrate surface.

Apparatus for molecular beam epitaxy

This invention relates to a semiconductor substrate and a method of manufacturing the same. In a semiconductor manufacturing process for a Si single crystal wafer or the like, before the step of mirror polishing, the rear surface of a Si wafer is ground to form a damaged layer having a certain fixed thickness, the Si wafer is subsequently etched by chemical etching if desired, and the rear surface is further formed with an oxide film by thermal oxidation if desired, whereby a semiconductor substrate exhibiting an intense gettering effect is manufactured.

Semiconductor substrate and a manufacturing method thereof

A precision table for a machine tool or the like, which table mounts a workpiece and is adapted to be selectively moved or slid in two directions by a low viscosity bearing such as an externally pressurized air bearing. The bearing includes at least one guide of a substantially J-shaped cross-sectional configuration with a jet arrangement being provided within the guide for jetting a pressurized gas through at least one orifice toward at least one internal surface of the guide. The jet arrangement is disposed within the guide which is fixedly arranged on a flat surface of a bed so that the table is supported by an air film in a clearance between the jet arrangement and portions of the guide.

Two-dimensional precision table

A surfacing or finishing machine for precision machining of a workpiece which includes a grinding wheel or edging tool installed on a working spindle, a driving motor for rotating the working spindle, and a power transmitting system for transmitting power from the driving motor to the working spindle. The power transmitting system includes a flexible link mechanism fashioned of a number of link belts or the like interconnected in series by a number of rotatable pulleys. The driving motor and power transmitting system are so arranged with respect to the surfacing and finishing machine that the working spindle is isolated from adverse vibrations which result from the operation of the driving motor and power transmission system.

Machining arrangement with means to isolate vibrations from the working

Growing community of inventors

Mitaka, Japan

Shigeo Kato