Sony Corporation

Other

Shigeo Ikeda

Kazuhiko Ueda

Yuichi Takagi

Masayoshi Kanazawa

Makoto Tsuchimochi

Takashi Saito

Hisataka Izawa

Masumi Okutsu

Hiroshi Nagano

Yasuo Maru

Kenzo Suzuki

Toshimasa Hiroike

An electric curtain opening and closing device includes a curtail rail and a movable body arranged in the curtail rail. The curtain rail has a hollow portion that is hollow extending in a longitudinal direction, and an opening opened in the longitudinal direction on its bottom face. Power supply patterns for supplying electricity are arranged inside left and right side faces that constitute the hollow portion in the longitudinal direction. The movable body has electrodes in contact with the respective power supply patterns, an electric motor receiving electricity through these electrodes to positively or negatively rotate, and a hanging portion for hanging a curtain. The movable body is driven to move by the electric motor. When the movable body is arranged in the hollow portion of the curtain rail, the hanging portion protrudes from the opening of the curtain rail.

Electric curtain opening and closing device and curtain opening and closing method using the same

At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.

Solid-state imaging apparatus and camera using the same

At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.

A socket for an IC used in electrically connecting the IC to a test device for testing electrical properties of the IC. The socket for an IC includes a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC, with the opening facing the anisotropic electrically conductive adhesive. The socket for an IC also includes a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening. The contact electrodes and the coil-shaped contacts facing each other via the anisotropic electrically conductive adhesive are mechanically and electrically connected to each other via the anisotropic electrically conductive adhesive.

Socket for IC and method for manufacturing IC

While the lens fitting member is temporarily bonded on the printed circuit board by a semi-hardening adhesive, the lens fitting member is located so as to adjust the lens to a specific position in relation to the solid-state image sensing element, and the semi-hardening adhesive is then hardened to completely bond the lens fitting member on the printed circuit board, thus reducing the assembly man-hour of a solid-state image sensing device in which a solid-state image sensing element is mounted on a printed circuit board and a lens fitting member with a lens fitted on is provided so as to adjust the lens to a specific position in relation to the solid-state image sensing element.

Light receiving device having lens fitting element

An IC measuring and testing device and measuring and testing method comprising a measurement handler socket provided with mold-receiving base having guiding members corresponding to the shape of a mold body of an IC to be tested around its periphery and probes for contacting outer leads of the IC, and a suction arm for suction-supporting the IC and transferring it to the mold-receiving base, the IC measuring and testing device performing measuring and testing on the IC mounted in the mold-receiving base by means of the suction arm, the guide members corresponding to and separated from the outer leads of the IC, and terminal portions of the probes being arranged inserted into these separation portions. As a result, when the IC is set, the guide members and the like of the socket can be prevented from striking against the outer leads of the IC and deforming them.

Growing community of inventors

Kanagawa, Japan

Shigeo Ikeda