Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Shigeo Amagi

Mitsuru Onoda

Tomoya Tsunoda

Tatsuo Honda

Osamu Miyo

Keiichi Morikawa

Akio Takahashi

Osamu Koizumi

Motoyo Wajima

Hideaki Mori

Tadashi Sonobe

Yasuomi Yagi

Saburo Usami

Katsuhide Oohashi

Kinya Nakatsu

Akira Nagai

Ryuichi Saito

Toshiya Satoh

Haruo Akahoshi

Takeshi Tokuyama

Akio Mukoh

Yuichi Satsu

Toshikazu Narahara

Nobutake Tsuyuno

Takao Miwa

Masao Suzuki

Hiroshi Suzuki

Sadayuki Aoki

Kunio Miyazaki

Shunichi Numata

Tomoji Oishi

Ryuji Watanabe

Masahiro Suzuki

Tohru Koyama

Toru Koyama

Hitoshi Oaku

Osamu Miura

Hideaki Ishikawa

Yoshihiro Suzuki

Ikushi Kano

Kiyonori Kogawa

Morimichi Umino

Yasuo Hanawa

Hirokazu Takasaki

Katsumi Kondou

Toshinari Takada

Koo Honjo

Yasuhiro Mizuno

Satoshi Murakawa

Katsuhide Ohashi

A pre-molded part is formed by pre-molding an insert with a pre-molded member, and then the pre-molded part is inserted into an over-molded member composed of thermo plastic resin. After applying a heat treatment with a temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert, a firm contact between the insert and the resin surrounding the insert without a gap at the interface between those parts is obtained.

Structure of parts made from plural composite pieces and method of building those parts

A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.

Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module

Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.

Composite moldings and a method of manufacturing the same

An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.

Molded part and electronic device using the same

A highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated. Also disclosed is a method of manufacturing such a stator, and a rotary machine using the same. The resin-molded stator of the present invention comprises a stator core, electrically insulated stator coils wound around the plurality of slots or protrusions provided in the axial direction of the stator core, and molding resin with which are molded the stator core and the stator coils located at the aforementioned slots or protrusions and at the stator core end, wherein the resin-molded stator is characterized in that non-adhesive structure is established between the molding resin and at least one of the end faces of the stator core.

Method of manufacturing a resin-molded stator

A highly reliable resin-molded stator not suffering insulation breakdown between different phases of stator coils even when the operation mode is repeated where the output of a rotary machine using a resin-molded stator is to be increased from the level under a stopped status to the maximum achievable level within a short time. Also provided are methods of manufacturing such a stator, and a rotary machine using the same. The a resin-molded stator of the invention comprises a stator core, electrically insulated stator coils wound around the plurality of slots or protrusions provided in the axial direction of the stator core, and molding resin with which are molded the stator core and the stator coils located at the aforementioned slots or protrusions. At the stator core end, non-adhesive structure is established between the molding resin and at least one of the end faces of the stator core.

Resin-molded stator, a method of manufacturing the same, and a rotary machine using the same

In order to provide an electric machine winding having an insulating layer excellent in electric characteristics and an insulating layer of an electric machine winding excellent in electric characteristics, a high-thermal-conductivity insulating layer is formed around the peripheral portion of a winding conductor by the use of a high-thermal-conductivity insulating tape having a mica layer , a reinforcing material layer , and a high-thermal-conductivity filler layer , wherein the amount of resin of the mica layer makes up 10 wt % to 25 wt % of the total weight of the insulating material and wherein the amount of resin of the high-thermal-conductivity filler layer makes up 10 wt % to 25 wt % of the total weight of the insulating material.

Insulating material and electric machine winding and method for manufacturing the same

A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.

Display device substrate and display device formed therewith

In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film is formed at outer periphery of wound conductor using a high heat conductive insulating tape, which includes a mica layer a reinforcement layer and a high heat conductive filler layer wherein the resin content in each layer of the mica layer and the high heat conductive filler layer is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.

Insulating material, windings using same, and a manufacturing method thereof

The thermal expansion coefficient of a composite insulator layer is adjusted in order to suppress warping deformation in a multilayer printed wiring board caused by temperature change. The thicknesses and the covering ratios on the both sides of the electric conductor layer composing the multilayer printed wiring board are asymmetric with respect to the central plane. A multilayer printed wiring board is formed by laminating composite insulation layers and laminated bodies, the composite insulation layer being made of a cloth a resin impregnated into the cloth, the laminated body being composed of electric conductor layers formed by coating on a surface of the composite insulation layer. The thermal expansion coefficient of the composite insulation layer having a conductor layer with a higher covering ratio is set to be smaller than the thermal expansion coefficient of the composite insulation layer having a conductor layer with a lower covering ratio.

Multilayer printed wiring board and electronic equipment

An electric rotating machine having a rotor, rotatably disposed in an inner radius side of a stator through a gap, including rotor windings contained in a plurality of slots formed in a rotor core, a slot insulation placed between the rotor winding and the slot, an insulation block placed between a wedge arranged at a peripheral side of the rotor core outward of the rotor winding of the slot and the rotor winding. At least one of the slot insulation and the insulation block is an insulation formed by filling or mixing granular and/or short-fiber insulating materials having a thermal conductivity higher than 5 W/m&middot;K in a resin and a thermal conductivity in a thickness direction higher than 0.35 W/m&middot;K.

Electric rotating machine

In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film,is formed at outer periphery of wound conductor,using a high heat conductive insulating tape, which includes a mica layer,, a reinforcement layer,, and a high heat conductive filler layer,, wherein the resin content in each layer of the mica layer,and the high heat conductive filler layer,is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.

Insulating material windings using same and a manufacturing method thereof

An the electric rotating machine which is compact and of reduced cost by improving the thermal conductivity of the main insulation in the thickness direction while maintaining the insulation breakdown voltage of the main insulation high. The initial breakdown voltage V in the thickness direction of the main insulator 30 of the stator winding 3 is higher than 20 kV/mm, and the thermal conductivity &lgr; in the thickness direction is within a range of 0.35 to 1 W/m&middot;K, and the product V&lgr; of the initial breakdown voltage V and the thermal conductivity &lgr; satisfies a relationship of 7&lE;V&lgr;&lE;20 (MWA/m,&middot;K). The amount of resin is within a range of 20 to 50 weight % of the main insulation material.

Electric rotating machine with reduced thickness and volume of insulation

The high thermoconductive insulating film 11 was formed around the outer periphery of the wound conductors 10, using the high thermoconductive insulating tape 1 comprising the mica layer 3, the reinforcement layer 5, and the high thermoconductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high thermoconductive filler layer 7 is specified to the range of 10-25% by weight of the total weight of the material.

Insulating material and windings thereby

A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

Multi-layer wiring structure

Growing community of inventors

Tokai-mura, Japan

Shigeo Amagi