Mitsubishi Electric Corporation

Mitsubishi Electric Research Laboratories, Inc.

Shigenori Takeda

Yoshinao Tatei

Toru Sasaki

Amit Kumar Agrawal

Hajime Nakajima

Jay E Thornton

Osamu Nasu

Takeshi Musha

Takuya Noguchi

Haruhiko Takeyama

Makito Seki

Masanori Nimura

Ikio Sugiura

When a plating layer is formed on through holes in semiconductor packages, first and second stacked bodies are stacked with first and second cavities formed in the first and second stacked bodies facing the inner side and are bonded together by applying adhesive to peripheral regions so that the cavities of the first and second stacked bodies form sealed spaces, and the through holes are formed such that part of the first and second stacked bodies including the bonding surface remains. Then, the through holes are plated to form the plating layer, the peripheral regions are removed as cutting allowances, i.e., removal regions, and the first and second stacked bodies are divided into a plurality of pieces along dicing lines to form semiconductor packages.

Manufacturing method of semiconductor package

To obtain a position detection device capable of detecting highly accurate and robust position by suppressing affect of error detection of an edge, provided is a configuration for performing a validity determination of edges detected by binarizing an image signal () converted by a light-receiving element () for receiving light irradiated from a light source () toward a scale () having a code pattern, and performing position detection after removing the edges determined to be invalid as edges that have been affected by foreign matter and the like among the edges on which the validity determination has been performed.

Position detection device

Provided is an absolute encoder capable of detecting the absolute angle at high resolution and with high precision. An image sensor receives light in an absolute value code pattern of a scale, an edge detecting unit detects from the received light signal an edge pixel position and an edge direction, and an edge position correcting unit corrects the edge pixel position based on the edge direction. A phase detecting unit detects from the corrected edge pixel position the phase shift amount of a shift from a reference pixel position of the image sensor, and a high precision detection unit uses a rough absolute position detected by a rough detection unit and the phase shift amount detected by the phase detecting unit to detect the absolute position with high precision.

Absolute encoder

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Chiyoda-ku, Japan

Shigenori Takeda