Nitto-Denko Corporation

Shigenori Morita

Takahiro Nakai

Takashi Oda

Yasuhito Ohwaki

Masayuki Satake

Kazuhito Hosokawa

Toshihiko Omote

Junichi Nagase

Masakatsu Urairi

Junichi Fujisawa

Tetsurou Ikeda

Ryohei Kakiuchi

Reiko Akari

Chieko Kitaura

Tadao Ohkawa

Shigeki Kawabe

Makoto Komatsubara

Naoko Yoshida

Akinobu Souma

Kazutaka Hara

Takezo Hatanaka

Hisashi Tsuda

Tomohiro Kontani

Tadao Ookawa

Seiki Teraji

Mayu Ozaki

Hiroto Nishii

Jin Yoshikawa

Toshio Shintani

Manabu Miyazaki

Kanako Hida

Masahiko Watanabe

Takeshi Yoshimi

Takashi Minemoto

Chiharu Odane

Yoshinori Osaki

The present invention provides a sensor cell that has excellent measurement accuracy in repetitive measurement. An optical waveguide of the present invention includes a cladding layer and a core layer buried in the cladding layer so that at least one surface of the core layer is exposed. A water contact angle of a surface of the cladding layer on which the core layer is exposed is 80&#xb0; or more. An SPR sensor cell and a colorimetric sensor cell of the present invention each include the optical waveguide of the present invention.

Optical waveguide, and SPR sensor cell and colorimetric sensor cell each using same

Provided is a method for manufacturing an organic EL device, including: a vapor deposition step of forming an organic layer over a substrate moving relative to a nozzle by discharging a vaporized organic layer-forming material through the nozzle. The vapor deposition step is performed so that a light emitting region formed of the organic layer and having a width A (mm) in a direction perpendicular to a direction in which the substrate is moving is formed, and so that W&#x2267;A+2&#xd7;h (where h&#x2266;5 mm) is satisfied, where a length of an opening of the nozzle in the direction perpendicular to the direction in which the substrate is moving is denoted by W (mm), and a distance between the opening and the substrate is denoted by h (mm).

Method and apparatus for manufacturing organic EL device

In order to provide an organic electroluminescent light-emitting device with less uneven brightness, which can be manufactured at low cost, a plurality of ribbon-like organic electroluminescent elements are connected to wires, which are connected to electrode terminals for energization at specific locations in a terminal region and mounted on a base material which has a substantially plate-like shape.

Organic electro-luminescence light-emitting device and production method of the same

Provided is a method for manufacturing an organic EL device which suppresses a deterioration in the light emission properties. In this method, while first and second electrode layers are prevented from being in contact with each other, an organic layer is allowed to protrude from the first electrode layer toward at least both outer sides in the longitudinal direction of a substrate. Further, the second electrode layer is allowed to protrude from the organic layer toward at least both outer sides in the longitudinal direction. Thereby, the first electrode layer, the organic layer, and the second electrode layer are formed so that both end edges of the organic layer in a longitudinal direction of the substrate are covered by both end sides of the second electrode layer in the longitudinal direction, on at least both outer sides of the light emitting part in the longitudinal direction.

Method for manufacturing organic EL device and organic EL device

A surface light emitter according to an embodiment of the present invention, includes: a base material; a plurality of ribbon-shaped organic electroluminescent elements provided side by side on the base material; and a lenticular sheet that is attached to the base material and the ribbon-shaped organic electroluminescent elements through an adhesion layer, and that has a plurality of convex cylindrical lenses provided side by side. A direction in which the convex cylindrical lenses extend and a direction in which the ribbon-shaped organic electroluminescent elements extend are substantially parallel to each other.

Surface light-emitting object

An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.

Adhesive for polarizing plate, polarizing plate, manufacturing method therefor, optical film and image display

A wireless electric power supply type light-emitting elementof the present invention includes a substrate; a light-emitting structure provided on the substrate; and a sealing layerprovided on the light-emitting structure, wherein the light-emitting structure includes an electric power receiving antennaand an organic electroluminescence element provided on the installation surface of the substrate; and two connecting wiresandfor electrically connecting the electric power receiving antennaand the organic electroluminescence element, the electric power receiving antennais covered with an insulating layerexclusive of two terminalsandof the electric power receiving antennato which the end parts of the two connecting wiresandare connected, and the light-emitting structure is sealed between the substrateand the sealing layer

Wireless electric power supply type light-emitting element and light-emitting device

A CIGS film production method is provided which ensures that a CIGS film having a higher conversion efficiency can be produced at lower costs at higher reproducibility even for production of a large-area device. A CIGS solar cell production method is also provided for producing a CIGS solar cell including the CIGS film. The CIGS film production method includes: a stacking step of stacking a layer (A) containing indium, gallium and selenium and a layer (B) containing copper and selenium in a solid phase in this order over a substrate; and a heating step of heating a stacked structure including the layer (A) and the layer (B) to melt a compound of copper and selenium of the layer (B) into a liquid phase to thereby diffuse copper from the layer (B) into the layer (A) to permit crystal growth to provide a CIGS film.

Method of producing CIGS film, and method of producing CIGS solar cell by using same

An organic EL device manufacturing method includes a step of supplying a substrate, and while moving the substrate with a non-electrode-layer side thereof in contact with a surface of a can roller, the non-electrode-layer provided with no electrode layer, discharging a material from a nozzle of a vapor deposition source to form an organic layer on an electrode-layer side of the substrate, the electrode-layer side provided with an electrode layer. The vapor deposition step includes supplying a shadow mask including an opening portion to interpose the shadow mask between the substrate contacting the can roller, and the nozzle; and forming the organic layer corresponding to the opening portion on the electrode-layer side of the substrate while moving the substrate and the shadow mask with through holes included at each of the substrate and the shadow mask engaged with projections included in the can roller.

Organic el device manufacturing method and apparatus

A conductor layeris formed as a circuit pattern on a base insulating layer, a terminalis formed thereon, and a supporting columnis formed in the vicinity of the terminal on the upper face of the base insulating layer. Here, supposing the protrusion height B of the bump from the element to be connected is B, the height of the supporting column is H, the height of the terminal is h, and the layer thickness of the terminal is t, as measured from the upper face of the base insulating layer as the reference surface, the height H of the supporting column is determined to satisfy B&#x3c;H&#x3c;h+B wherein t&#x3c;B, or h&#x3c;H&#x3c;h+B wherein t&#x2267;B. As a result, the supporting column functions as a spacer to suppress compression that causes the solder of the terminal to reach the electrode of the element.

Wiring circuit structure and manufacturing method for semiconductor device using the structure

A wiring circuit layerhaving at least a wiring part and an insulating part, whose top and bottom surfaces (A,B) is adhesive surfaces, is formed on a metal support substratein a way such that the layercan be peeled from the substrate. Exposed in the first adhesive surfaceA of the wiring circuit layeris a first connecting conductor part, which is connectable with an electrodeof a first semiconductor elementin a wafer state. After the wiring circuit layeris laminated on and connected to the element, the metal support substrateis peeled from the wiring circuit layerto yield a semiconductor device. Another element may be connected to the other adhesive surfaceB exposed upon the peeling.

Method of manufacturing a semiconductor device by lamination

A wiring circuit layerhaving a connecting conductor partthat can be connected to an electrodeof a semiconductor elementis formed on a metal support substratein a way such that the wiring circuit layer can be separated from the substrate, and that the connecting conductor partis exposed on the upper face of the wiring circuit layer. The wiring circuit layeris laminated on the elementwhile in a wafer state, and the connecting conductor partand the electrodeare connected. Subsequently, the support substrateis peeled from the wiring circuit layer, and the wafer is diced, whereby individual semiconductor devices are obtained.

Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element

The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layeris formed in a given pattern on one surface of a supporting substrate, a circuit patternis formed on the insulating layerwhile forming a dummy patternin an area free of the insulating layeron the one surface of the supporting substrate, and an unnecessary part of the supporting substrate, which is free of the insulating layerand the circuit pattern, is removed by dissolution together with the dummy pattern

Production method of printed circuit board

A wired circuit board having a terminal portion formed as a flying lead that can provide enhanced strength of the conductive pattern, both sides of which are exposed, by simple construction to effectively prevent disconnection of the conductive pattern. The wired circuit board having the terminal portion formed as the flying lead in which the both sides of the conductive pattern are exposed includes, in crossing areas where ends of a cover-side opening and ends of a base-side opening and the conductive pattern are crossed each other, (i) the widened portions formed in the conductive pattern or (ii) cover-side projections and base-side projections formed in the cover layer and the base layer, respectively.

Growing community of inventors

Ibaraki, Japan

Shigenori Morita