Fujitsu Corporation

The Furukawa Electric Co., Ltd.

Shigenori Aoki

Kishio Yokouchi

Tsuyoshi Aoki

Hidenobu Muranaka

Alexei L Glebov

Wataru Sotoyama

Yasuhiro Yoneda

Akio Sugama

Tetsuzo Yoshimura

Koji Tsukamoto

Takeshi Ishitsuka

Katsusada Motoyoshi

Satoshi Tatsuura

Masayuki Kato

Lidu Huang

Masaharu Hida

Katsuki Suematsu

Tomoyuki Akahoshi

Mitsuhiro Iwaya

Hiroshi Kamezaki

Tsuyoshi Yamamoto

Michael G Lee

Takeshi Shioga

Tsunetoshi Saito

Hiroki Uchida

Haruhisa Soda

Hiroshi Nagaeda

Wataru Yamagishi

Motoyuki Nishizawa

Susumu Ogata

Kaoru Sugimoto

Hideaki Nagaoka

An electronic apparatus includes a substrate and an optical connector connected to a waveguide on the substrate. The optical connector includes a ferrule that holds an optical fiber and has front and rear parts along a connecting direction of the optical connector with respect to the substrate. The ferrule has a hook and a presser member provided on a bottom face at the front part of the ferrule, a projection provided on the bottom face at the rear part of the ferrule, and a sloping part including a groove formed in the bottom face to hold the optical fiber. The optical fiber is held obliquely downward toward the substrate by the sloping part. The substrate has holes to receive the hook and the projection, and a groove to receive the optical fiber.

Electronic apparatus having optical connector connected to waveguide

An optical connector includes at least one optical fiber, and a ferrule configured to hold the optical fiber. In the optical connector, the ferrule has a hook and a presser member on a front part of a bottom face of the ferrule, and a projection on a rear part of the bottom face of the ferrule, in a connecting direction, and the optical fiber is held obliquely downward from a rear end of the ferrule toward the presser member of the ferrule.

Optical connector, electronic apparatus, and optical connector mounting method

A loop heat pipe system includes a loop heat pipe (LHP), a temperature sensor, a heater and a controller. The temperature sensor measures temperature of a working fluid portion of the LHP in which the working fluid has different phases depending on whether or not the LHP is in a disable status not to start up a heat transportation, in which a liquid phase of the working fluid does not exist in an evaporator of the LHP. The heater heats a heating target part of a vapor line. The controller, in order to start up the LHP, turns on the heater, monitors temperature of the heating target part using the temperature sensor, and turns off the heater when detecting a change in the monitored temperature, caused by condensation of a vapor phase of the working fluid.

Loop heat pipe system and information processing apparatus

An optical connector includes an optical fiber, and a ferrule configured to hold the optical fiber, wherein the ferrule has a front part, a rear part, a deformable mechanism to connect between the front part and the rear part, and an opening to allow the optical fiber to bend along with displacement of the deformable mechanism, and wherein the deformable mechanism has a restrictor to restrict the displacement or deformation of the deformable mechanism, the restrictor being provided at least between the deformable mechanism and the front part or between the deformable mechanism and the rear part.

Optical connector

An optical connector includes: a holding member that holds an optical transmission line; a lens member that has a lens; a concavo-convex structure provided between the holding member and the lens member; and a moving member that moves the concavo-convex structure between a first state where a protrusion and a recess of the concavo-convex structure are engaged with each other and a second state where a gap is formed between the protrusion and the recess.

An optical connector includes a fiber holder with guide holes for guiding optical fibers, a space communicating with the guide holes and to accommodate the optical fibers, and a deformable member that forms at least a part of the fiber holder and causes the space to deform or displace to allow a part or all of the optical fibers to bend in the space.

Optical connector, optical fiber incorporating method, and electronic information equipment

An optical connector includes a fiber holder to hold optical fibers; a housing to accommodate the optical fibers and the fiber holder; and a thermally driven actuator to displace at least a part of the fiber holder upon application of heat from a first position at which the fiber holder is retracted inside the housing to a second position that allows the optical fibers to be optically coupled to a counterpart connector.

Optical connector and electronic equipment using the same

An apparatus comprises one or more electro-optical coupling modules. An electro-optical coupling module comprises a diode, a flexible optical coupling element, a reflective surface, and an optical fiber. The diode performs an electro-optical conversion on a signal. The flexible optical coupling element communicates the signal between the diode and the reflective surface. The reflective surface reflects the signal between the flexible optical coupling element and the optical fiber.

Optically coupling components of a transceiver

An optical module includes a substrate, one or a plurality of planar optical devices mounted on the substrate, and a waveguide block including one or a plurality of curved waveguides formed on a plane. The waveguide block is mounted on the substrate such that the plane on which the curved waveguides are formed is perpendicular to the substrate and the curved waveguides and an incidence face or an emitting face of the planar optical device are opposed to each other on one end face of the waveguide block. Further, the waveguide block is configured so that an optical fiber can be connected to the other end face of the waveguide block which is orthogonal to the one end face.

Optical module, optical transmission system, and fabrication method for optical module

An optical module with a first optical waveguide substrate having end faces; a second optical waveguide substrate which includes a first optical waveguide, a second optical waveguide, and end faces, the second optical waveguide substrate having an opening between the first optical waveguide and the second optical waveguide; and a first deflection device which is mounted in the opening, wherein one of the end faces of the first optical waveguide substrate and one of the end faces of the second optical waveguide substrate are coupled to each other.

Optical module method of manufacturing the same

Disclosed is an optical waveguide structure capable of keeping intervals between the structure and optical elements within a certain range. When arranging a surface light emitting element and a surface light receiving element on a positioning plate provided on a substrate, elastic layers are provided between the elements and the plate. When fitting and fixing first projections of the structure in holes of the plate, second projections formed in a predetermined dimension on the structure are brought into contact with the light emitting element and the light receiving element. Therefore, intervals between lenses, and the light emitting element as well as the light receiving element are controlled within a certain range according to the dimension of the second projections. Further, stress occurring due to contact is dispersed by the elastic layers so that breakage of the light emitting element and the light receiving element can be prevented.

Optical waveguide structure, optical module and lens array

In a semiconductor chip module, a transmission optical waveguide device to be mounted in the proximity of the side face of a semiconductor chip on a circuit board includes an input optical waveguide to which light from an external light source is inputted, an output optical waveguide provided at a position displaced in a vertical direction to the surface of the circuit board in a mounted state on the circuit with respect to the input optical waveguide for outputting an optical signal to a different device, an optical path changeover structure for guiding light guided through the input optical waveguide to the output optical waveguide, and an optical modulator provided on the input optical waveguide or the output optical waveguide for modulating light from the external light source based on an electric signal from the semiconductor chip.

Semiconductor chip module

An optical module with a plurality of optical waveguide substrates having element mounting openings and end surfaces which are adhered to each other with an optical adhesive; and a plurality of light deflecting element arrays mounted to the respective element mounting openings of the plurality of optical waveguide substrates, the plurality of light deflecting element arrays including a plurality of light deflecting elements.

Optical module and method of manufacturing the same

The optical module includes a first optical waveguide part including a first waveguide core, a second optical waveguide part including a second waveguide core and provided such that the second waveguide core and the first waveguide core are positioned partially close to each other so that a light propagating in one of the first and second waveguide cores can be coupled to the other of the first and second waveguide cores, an electro-optic material layer provided between the first and second waveguide cores and formed from an electro-optic material, and an electrode for applying an electric field to the electro-optic material layer so that the refractive index of the electro-optic material layer varies and the optical coupling coefficient between the first and second waveguide cores varies.

Optical module and mounting deviation compensation method for optical waveguide part

Methods and apparatuses for measuring the optical properties of solids, gels, and liquids are disclosed. The apparatuses may be constructed on miniature substrates using conventional semiconductor wafer and packaging processes. The substrates may be mass-produced on wafers, which are then diced to provide individual miniature substrates. High measurement precision, low-manufacturing costs, and other benefits are provided by the present inventions.

Growing community of inventors

Sunnyvale, CA, United States of America

Shigenori Aoki