Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Shigenobu Komatsu

Hiroshi Onuki

Hideyuki Sakamoto

Takeo Hosokawa

Masayuki Hio

Ryo Ando

Junji Onozuka

Hiroshi Nakano

Shinya Igarashi

Masaru Kokubo

Takuya Aoyagi

Hiroshi Shinoda

Tatsuya Miyake

Takashi Naitou

Daisuke Terada

Kentarou Miyajima

Hidetatsu Yamamoto

Mizuki Shibata

Toshiaki Takai

Yoshiyuki Akiyama

Kentaro Miyajima

Tomoyuki Takada

A circuit for EMCin a power input circuit includes at least two wirings of a high-potential-side wiringand a low-potential-side wiringhaving different potentials and formed on a circuit board, a cutoff parthaving one end connected to the high-potential-side wiring, a capacitorconnected between the other end of the cutoff partand the low-potential-side wiring, a cutoff parthaving one end connected to the high-potential-side wiring, a capacitorconnected between the other end of the cutoff partand the low-potential-side wiring, and a capacitorconnected between a connection partwhere the cutoff partand the capacitorare connected and a connection partwhere the cutoff partand the capacitorare connected.

Vehicle-mounted electronic control device

Provided is a highly reliable electronic control unit capable of improving responsiveness of an output current of a switching power supply to load current variation and suppressing power supply voltage variation accompanying the load current variation at low cost and with high power efficiency. Provided are: a calculation unit that performs signal processing; a first power supply circuit that supplies a first power supply voltage to the calculation unit; and a second power supply circuit that supplies a second power supply voltage to the first power supply circuit. The calculation unit has a function of outputting a control signal when a change in a consumed current of the calculation unit exceeds a predetermined threshold, and changes any one or both of a control scheme of the first power supply circuit and the second power supply voltage according to the control signal.

Electronic control unit

Provided is an in-vehicle control system capable of reducing an increase in cost accompanying advancement of a fallback operation. Therefore, the in-vehicle control system includes: a plurality of control circuitsandrespectively including control units that perform data communication with each other; an external environment recognition sensor a; and a plurality of wirings, andconnecting the external environment recognition sensor aand the plurality of control circuitsand. The plurality of control circuitsandinclude: a first power supply unit that supplies power to the external environment recognition sensor avia a corresponding wiring among the plurality of wirings, and; and a first detection unit that detects an abnormality related to the power supplied to the external environment recognition sensor a. A control unit in a control device including a first detection unit that has detected the abnormality is controlled to acquire data of the external environment recognition sensor afrom a control unit included in the other control device.

In-vehicle control system

According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360&#xb0;.

Humidity measurement device

A thermal humidity measuring device includes first and second heating elements, and is capable of obtaining a plurality of measurement values (measured values) by effectively utilizing each of the heating elements, which includes measuring humidity by the first heating element. A thermal humidity measuring device includes a first bridge circuit that includes a first heating element that senses humidity, and a second bridge circuit that includes a second heating element that heats air around the first heating element. In the thermal humidity measuring device, a first output signal is extracted from the first bridge circuit, and the humidity is sensed. A second output signal is extracted from the second bridge circuit, and the second output signal includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Thermal humidity measuring device

Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass. A thermal expansion coefficient of the first bonding layer is equal to or lower than a thermal expansion coefficient of the second bonding layer, a softening point of the second bonding layer is equal to or lower than a heat resistant temperature of the semiconductor chip, and a softening point of the first bonding layer is equal to or lower than the softening point of the second bonding layer.

Physical quantity measurement device, method for manufacturing same, and physical quantity measurement element

The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Semiconductor device

A pressure detecting device is mounted in a measurement target and instrument includes a strain inducer to which pressure of a pressure medium is applied and which generates strain in accordance with the pressure and a strain detecting element that is bonded onto a surface opposite to a pressure receiving surface of the strain inducer, in which the strain detecting element includes one or multiple central strain resistant bridges which are arranged at a central portion of the strain detecting element in a bonded surface direction, and one or multiple outer peripheral strain resistant bridges which are arranged at an outer periphery, and in which, for example, deformation of the strain detecting element caused by an external force when being screw-fixed to the measurement target instrument is obtained through the multiple strain resistant bridges. An error of detection pressure caused by the deformation in a pressure value detected through the central strain resistant bridge is corrected.

Pressure detecting device

Growing community of inventors

Hitachinaka, Japan

Shigenobu Komatsu