Idemitsu Petrochemical Co., Ltd.

Shigemasa Suzuki

Tomoyoshi Murakami

Toru Iga

Satoru Kinouchi

Eiji Tamura

Yutaka Tsubokura

Provided is a polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and/or (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C). The composition has good PCT and TCT acceptable quality and good fluidity, naturally having good properties intrinsic to ordinary PAS resin, and which, when used for sealing electronic parts, causes neither deformation of bonding wires and other elements nor package breakdown, and is therefore favorable to materials for sealing electronic parts.

Polyarylene sulfide resin composition for electronic parts encapsulation

Provided is a polyarylene sulfide resin composition comprising (A) from 20 to 34% by weight of a polyarylene sulfide having a melt viscosity of from 150 to 800 poises, (B) from 66 to 80% by weight of spherical silica having a mean particle size of from 0.3 to 10 &mgr;m, and (C) from 0 to 12% by weight of whiskers, in which the total of the spherical silica (B) and the whiskers (C) falls between 66 and 80% by weight. The composition has well-balanced physical properties of dimensional accuracy and mechanical strength, and has good moldability. It is favorable to moldings for precision members such as optical fiber connector ferrules, etc.

Polyarylene sulfide resin composition

Provided is a polyarylene sulfide (PAS) resin composition having extremely high dimensional accuracy and favorable to fiber-optics connector members, etc. The PAS resin composition for optical telecommunication members comprises (A) from 20 to 35% by weight of a polyarylene sulfide having a crystallization temperature, as measured through differential scanning calorimetry, of not lower than 250&deg; C., and (B) from 65 to 80% by weight of silica, preferably spherical silica having a mean particle size of from 1 to 10 &mgr;m.

Polyarylene sulfide resin composition for optical telecommunication members

A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) an aliphatic or saturated cyclic polycarbodiimide resin or a precursor thereof, and preferably (C) reactive silicone compound grains, and (D) a polyethylene naphthalate resin or (E) a filler, which improves excellent properties exhibited by polyarylene sulfide resins, and which is also endowed with an excellent adhesion characteristics to adhesives such as epoxy resins. In addition, a molded article obtained by molding a polyarylene sulfide resin composition endowed with such excellent properties is useful as a container for accommodating an electric component material. Such a molded article may also be used as an electronic component having conductive portions which are totally or partially accommodated in the container, wherein the conductive portions are seled by a sealant encapsulated in the container.

Disclosed are slide members for parts to be in contact with magnetic tape, which are made of polyarylenesulfide resin compositions comprising from 20 to 40% by weight of a polyarylenesulfide resin optionally combined with an amorphous, thermoplastic resin, and from 60 to 80% by weight of calcium metasilicate whiskers having a mean fiber diameter of not larger than 5 .mu.m and a mean aspect ratio of not smaller than 5, optionally combined with an inorganic filler. While being shaped, the resin compositions have good fluidity. The slide members are used in electric and electronic devices as the parts to be in contact with magnetic tape, for example, as VTR cylinders (drums). The slide members have high mechanical strength and good dimensional stability, and have good slidability with magnetic tape.

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Ichihara, Japan

Shigemasa Suzuki