Rohm Co., Ltd.

Hit Devices Ltd.

Shigemasa Sunada

Hideo Taniguchi

A building material discharge head is provided with, a flow path structure which, by stacking multiple plate-form bodies having a through-hole and closing both ends of the through-holes, forms a flow path in the direction orthogonal to the through-holes and in a long direction of an elongate shape of the through-holes, and in which a discharge opening is formed in at least one end of the body to communicate with the path, a thin plate which closes one side of the path, which is at one end of the through-holes, a heating plate which is provided on the opposite side and which heats the inside of the path, a closing plate which is provided on the other surface of the path, which is the other end of the through-holes, and an LED which is provided near the discharge opening and which irradiates light along the direction of the path.

Printhead dispensing deposition material, method of forming printed object, flow path structure body and heating plate for dispensing deposition material from flow path

A surface mounting type diode is provided which comprises: a diode chip; a pair of leads held in electrical conduction with the diode chip, each of the leads including an inner end, an outer end, a first bend closer to the inner end, a second bend closer to the outer end, and an intermediate portion between the first and second bends; and a resin package enclosing the diode chip together with part of the respective leads, the resin package having a flat bottom surface. The inner end, first bend, second bend and intermediate portion of the lead are contained in the resin package. Further, the outer end of the lead has an exposed flat mounting surface flush with the bottom surface of the resin package.

Surface mounting type diode

A central region of the bottom surface of a resin in which a diode chip and a base end portion of each of two lead terminals electrically connected to the chip is burning-treated by irradiating a laser beam in order to remove fat and oil existing in the bottom surface. Thereby, the deterioration of adhesive strength of an adhesive agent for fixing the bottom surface of the resin to a circuit board is prevented.

Growing community of inventors

Kyoto, Japan

Shigemasa Sunada