Hitachi, Ltd.

Shigemasa Satoh

Tadakatsu Nakajima

Yoshihiro Kondo

Akio Idei

Haruhiko Matsuyama

Hiroyuki Toyoda

Shigeyuki Sasaki

Kenichi Sugeno

A cooling system for cooling a CPUmounted on a printed circuit boardwithin a housing thereof, has a heat-receiving jacket, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenserreceives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

Cooling system and electronic apparatus applying the same therein

To form in a batch manner a thin-film wiring pattern in high precision over an entire region of a ceramics multilayer wiring board containing distortion and deformation, a correction amount of the ceramics multilayer wiring board (rotation angle and movement amount of position of this ceramics multilayer wiring board) is calculated in a computer by applying, for instance, the least squares method to positional coordinate values of each of the LSI mounting areas of the ceramics multilayer board and also to positional coordinate values corresponding thereto on a photomask. A support apparatus for supporting the multilayer wiring board is controlled based upon the calculated correction amount, so that the multilayer wiring board can be aligned with respect to the photomask.

Method for manufacturing multilayer wiring board and wiring pattern

Growing community of inventors

Hadano, Japan

Shigemasa Satoh