Mitsubishi Denki Kabushiki Kaisha

Renesas Technology Corp.

Other

Mitsubishi Electric Engineering Company, Limited

Shigeki Tomishima

Tsukasa Ooishi

Hideto Hidaka

Kazutami Arimoto

Mikio Asakura

Masaki Tsukude

Hiroki Shimano

Hiroaki Tanizaki

Masatoshi Ishikawa

Akira Yamazaki

Kazuyasu Fujishima

Hiroshi Kato

Takaharu Tsuji

Tadato Yamagata

Makoto Hatakenaka

Takahiro Tsuruda

Mitsutaka Niiro

Masanao Maruta

Fukashi Morishita

Masanori Hayashikoshi

Masakazu Hirose

Kazutani Arimoto

Shigehiro Kuge

Atsushi Miyanishi

Katsuhiro Suma

Shinji Kawai

Yutaka Komai

Yoshio Yukinari

Masashi Matsumura

Teruhiko Nakasu

A semiconductor integrated circuit device includes a logic circuit and a synchronous dynamic random access memory including a core unit, integrated on a single semiconductor chip. The semiconductor integrated circuit device includes a synchronous dynamic random access memory control circuit which receives external control signals for the synchronous dynamic random access memory from the logic circuit, and outputs internal control signals to the core unit of the synchronous dynamic random access memory. For testing of semiconductor integrated circuit device, external test signals are provided through external terminals. The external test signals are selected by a selector and are provided to the core unit of the synchronous dynamic random access memory for testing.

Semiconductor integrated circuit device comprising RAM with command decode system and logic circuit integrated into a single chip and testing method of the RAM with command decode system

In each of output buffer circuits arranged corresponding to respective output pads, a first output buffer having small current driving capability for a normal operation mode and a second output buffer having large current driving capability for a test operation mode are arranged in parallel with each other. One of the first and second output buffers is enabled and the other is set to an output high impedance state alternatively in accordance with a mode designating signal. Thus, an output buffer circuit capable of driving an output pad with optimal driving capabilities in a normal operation mode and in a test operation mode in a semiconductor device for use in a system in package is implemented.

Semiconductor device suitable for system in package

A first level metal interconnection line in a layer below a third level metal interconnection line serving as a main word line MWL is used as a shunting interconnection line and electrically connected to a first level polysilicon interconnection line constituting a sub word line SWL at prescribed intervals. By applying a hierarchical word line structure and a word line shunting structure both, a word line is driven into a selected state at high speed without increasing an array occupancy area and manufacturing steps.

Semiconductor memory device

An internal power supply potential generation circuit includes an overcharge prevention circuit connected to an internal power supply node. The overcharge prevention circuit includes a circuit outputting a signal to be determined that is determined by an internal power supply potential, a differential amplification circuit amplifying a difference in potential between the signal to be determined and a reference potential for output to a node as a signal indicating that current should be drawn, and a current draw circuit drawing current from the internal power supply node in response to the signal indicating that current should be drawn. Thus the semiconductor integrated circuit device of interest can provide a steady internal power supply potential.

Semiconductor integrated circuit device with internal power supply potential generation circuit

This semiconductor device is provided with a wiring called a body line (BDL), a body section of a memory cell transistor is connected to this body line (BDL), and a potential of the body section is controlled by a body section controller connected to the body line. As a result, it is possible to propose a novel structure capable of keeping the potential of the body section low and to provide a semiconductor device and a manufacturing method therefor, capable of improving operation performance by contriving circuit operation.

Semiconductor memory device having a low potential body section

Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss', and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss&#x2032;.

Semiconductor memory device capable of overcoming refresh disturb

An active region which forms two transistors included in a memory cell is arranged to have a strip shape along a predetermined axis crossing first and second bit lines at less than 90 degrees, whereby it is possible to reduce a junction area corresponding to a connection node of connecting the two transistors between the active region and a substrate and to reduce a leak current.

Semiconductor memory device having two-transistor, one-capacitor type memory cells of high data holding characteristic

To provide an address programming device free from laser-blowing, a first, thin gate oxide film is formed on a semiconductor substrate, a first gate electrode is formed thereon, a second, thick gate oxide film is formed thereon, and a second gate electrode is formed thereon. Such a device is connected in series to a MOS transistor of the opposite polarity and such arrangements are cross-connected together to form a latch circuit. Data to be programmed and the inverted version thereof are written in the programming device. Programmed information is read depending on the change in weight of the latch when the power supply is turned on.

Semiconductor device with address programming circuit

A memory array is divided into a plurality of memory sub blocks in row and column directions. A column selection line is provided in the column direction in a region between blocks. A block decoding circuit generating a local column selection signal is arranged corresponding to each of the memory sub blocks. A main I/O line pair group is provided for each of the memory sub blocks and each column of the memory sub block is connected to the corresponding main I/O line pair in accordance with the local column selection line. Thus, data with a desired bit width can be produced without any increase in area occupied by the array nor decrease in the speed of column access.

Fast accessible semiconductor memory device

For a write operation, a synchronous semiconductor memory device in a single-data-rate SDRAM operation mode selects a memory cell column in accordance with a column select signal produced from a write clock produced in synchronization with an external clock signal without shifting the write clock. In a double-data-rate SDRAM operation mode, the synchronous semiconductor memory device selects the memory cell column in accordance with the column select signal produced from the write clock produced in synchronization with the external clock signal and shifted by selected clocks.

Synchronous semiconductor memory device allowing control of operation mode in accordance with operation conditions of a system

Obtainable are a semiconductor chip making it possible to perform a thoroughgoing test easily without imposing a burden on the circuit of its body; a semiconductor device on which the semiconductor chip is mounted; and a process for producing the semiconductor device. The semiconductor chip includes a first test terminal connected to a terminal line that extends from a body of the chip, the test terminal being a terminal for being jointed to a test device, and a circuit-constituting terminal branched from the terminal line and connected to the terminal line that is connected to the first test terminal, the circuit-constituting terminal being a terminal for being connected to any other circuit element.

Semiconductor chip, semiconductor device, and process for producing a semiconductor device

An input protective circuit in a semiconductor integrated circuit device includes a bipolar transistor arranged for an interconnection layer. An N-type active region in the bipolar transistor is connected to an electrode of a program element. The electrode is connected to the interconnection layer. The interconnection layer supplies a high voltage for breaking a dielectric of a program element. A voltage on a P-type well is externally adjusted via a resistance element. Thereby, erroneous program due to serge entering at the interconnection layer can be avoided.

Antifuse address detecting circuit programmable by applying a high voltage and semiconductor integrated circuit device provided with the same

A boosting portion switches between an N channel MOS transistor with high drivability and a P channel MOS transistor with low drivability for transmitting a high potential at an internal node to an output node. The N and P channel MOS transistors are respectively operated when boosted potential Vpp is low and high.

Semiconductor device provided with boost circuit consuming less current

A plurality of memory devices are connected parallel to each other commonly to signal lines extending in one direction, and signals are transmitted in one direction along the signal lines. The sum of the time of signal propagation from a transmission unit to a selected memory device and the time of signal propagation from the selected memory devices to a reception unit is constant for every memory device. Therefore, offset in access times to the memory chips in the memory system can be eliminated.

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Hyogo, Japan

Shigeki Tomishima