Renesas Electronics Corporation

Fuji Jukogyo Kabushiki Kaisha

Shigeki Tanaka

Kazuaki Yoshida

Atsushi Harada

Kazuto Ogasawara

Hiroshi Fujii

Atsushi Fujisawa

Yasuhiro Toi

Masahiro Noda

Takashi Sato

Masakazu Sakano

Satoru Suzuki

Toshiyuki Shinya

Takafumi Konno

Masahiro Tani

A method of manufacturing a semiconductor device, includes providing a lead frame including a frame portion, including a through hole penetrating the lead frame, a device forming portion surrounded by the frame portion in plan view, including a die pad, and a semiconductor chip mounted on the die pad; after the providing step, sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and after the sealing step, removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole.

Method of manufacturing semiconductor device

To stably remove a resin body formed in a supply route of a resin in a sealing step. A leadframe has, in a sub-runner portion thereof, a sub-through-hole. The sub-through-hole has, along a first direction along which the sub-runner portion extends, a first portion located on the side of a main-runner portion and a second portion located on the side of a gate portion relative to the first portion. In a plan view, an opening width of the sub-through-hole in the first direction is greater than that of the sub-through-hole in a second direction perpendicular to the first direction. In a plan view, an opening width of the sub-through-hole in the second direction gradually decreases from the first portion to an end portion of the second portion on the side of the gate portion.

The reliability of a semiconductor device is prevented from being reduced. A planar shape of a sealing body is comprised of a quadrangle having a pair of first sides, and a pair of second sides crossing with the first sides. Further, it has a die pad, a controller chip (first semiconductor chip) and a sensor chip (second semiconductor chip) mounted over the die pad, and a plurality of leads arranged along the first sides of the sealing body. The controller chip and the leads are electrically coupled to each other via wires (first wires), and the sensor chip and the controller chip are electrically coupled to each other via wires (second wires). Herein, the die pad is supported by a plurality of suspending leads formed integrally with the die pad and extending from the die pad toward the first sides of the sealing body. Each of the suspending leads has an offset part.

Semiconductor device and manufacturing method therefor

The occurrence of a resin seal failure is suppressed. A molding step is carried out using a lead frame in which there are formed multiple air vent portions for discharging gas in each cavity formed in the upper die of a molding die to outside the cavity. The air vent portions are formed at positions overlapping with the other corner portions, arranged inside a gate portion of the cavity. Each of the air vent portions is led out from the other corner portions of the cavity to outside a clamp area and is extended along sides of the cavity, respectively, in the clamp area.

The yield of a semiconductor device is improved. Inside the resin sealing body which forms a semiconductor device, the semiconductor chip is sealed in the state where it has arranged aslant to the upper and lower sides of a resin sealing body. In the suspension lead which supports the die pad carrying this semiconductor chip, the small recess is formed in the fifth surface of the opposite side with the surface on which the semiconductor chip was mounted. This recess is a portion used as the starting point when making die padslanting. The side surface of the side near a die pad between two side surfaces of this recess is formed in the state where it inclined rather than the side surface of the side near the periphery of a resin sealing body.

Semiconductor device and manufacturing method of the same

A wire short-circuit defect during molding is prevented. A semiconductor device has a tab, a plurality of leads arranged around the tab, a semiconductor chip mounted over the tab, a plurality of wires electrically connecting the electrode pads of the semiconductor chip with the leads, and a molded body in which the semiconductor chip is resin molded. By further stepwise shortening the chip-side tip end portions of the leads as the first edge or side of the principal surface of the semiconductor chip goes away from the middle portion toward the both end portions thereof, and shortening the tip end portions of those of first leads corresponding to the middle portion of the first edge or side of the principal surface which are adjacent to second leads located closer to the both end portions of the first edge or side, the distances between second wires connected to the second leads and the tip end portions of the first leads adjacent to the second leads can be increased. As a result, it is possible to prevent the wire short-circuit defect even when wire sweep occurs due to the flow resistance of a mold resin.

A composite material-stiffened panel has a skin obtained by molding a fiber-reinforced resin composite material into a flat skin, stiffeners arranged in rows on one surface of the skin, and a fiber-reinforced resin-composite material stitched on the skin covering the stiffeners. The composite material-stiffened panel can be manufactured as follows: A first fabric material is placed on a tool having a panel-shaped surface. Stiffeners are placed on the first fabric materials. A second fabric material is placed on the stiffeners to cover at least some of the stiffeners. The second fabric materials are reformed to match the shape of the stiffeners. The reformed second fabric material is stitched on the first fabric material along edges of the stiffeners. All the materials are covered with a bagging film for vacuum. Resin is infiltrated into the fabric materials by a RTM or a RFI method. The infiltrated resin is heated to be hardened.

Composite material-stiffened panel and manufacturing method thereof

An lower skin portion structure is integrally molded by employing a front spar and a rear spar having rib posts, lower stringers, a lower skin prepreg, and lower rib chord prepregs, then an upper skin portion structure is integrally molded by employing upper stringers, an upper skin prepreg, and upper rib chord prepregs, then ribs are fastened to the rib posts and the lower rib chords of the lower skin portion structure by mechanical fastening device, and then the lower skin portion structure and the upper skin portion structure are coupled by fastening the upper skin portion structure to the front spar and the rear spar by fasteners and then fastening upper rib chords of the upper skin portion structure to the ribs by the mechanical fastening device, whereby a composite material wing is manufactured.

Growing community of inventors

Nanae, Japan

Shigeki Tanaka