Seiko Epson Corporation

Shigeki Sasayama

Akira Nakada

Masataka Nomura

Yoshiki Makiuchi

An integrated circuit includes first and second coils, a first pad connected to the first coil and to a resonator, a second pad connected to the second coil and to the resonator, and first and second output terminals. The first pad is arranged to provide signals between the resonator and the first coil. The second pad is arranged to provide signals between the resonator and the second coil. A distance between the first pad and the first coil is less than a distance between the first coil and the first output terminal and a distance between the first coil and the second output terminal. A distance between the second pad and the second coil is less than a distance between the second coil and the first output terminal and a distance between the second coil and the second output terminal.

Integrated circuit layout for an oscillation module

An oscillation module includes an SAW filter, and a high-pass filter formed in an integrated circuit, the high-pass filter has a coil part, a capacitance part, and a first interconnection adapted to connect the coil part and the capacitance part to each other, and the capacitance part includes a capacitance array.

Oscillation module, electronic apparatus, and vehicle

An oscillation module includes an oscillation circuit which includes a first coil and a second coil and a filter circuit which is provided at a stage subsequent to the oscillation circuit and includes a third coil. The first coil, the second coil, and the third coil are a part of an integrated circuit. The third coil is arranged so as to intersect a virtual straight line equidistant from the center of the first coil and the center of the second coil, in a plan view of the integrated circuit.

Oscillation module, electronic device, and moving object

An oscillation module includes a loop interconnection, a high-frequency output interconnection, a differential amplifier, and an output terminal, the differential amplifier is connected to the output terminal with the high-frequency output interconnection, the high-frequency output interconnection crosses the loop interconnection in a grade-separated manner, and the loop interconnection is different in thickness between a crossing part and a non-crossing part with the high-frequency interconnection.

Growing community of inventors

Fujimi, Japan

Shigeki Sasayama