Matsushita Electric Industrial Co., Ltd.

Shigeki Okamoto

Kiyoshi Fujihara

Masaya Tateyanagi

Masanori Minamio

Toshiyuki Fukuda

Hiroyuki Ishida

Masanori Mimamio

A copper frame plate () has a central frame plate () and a pair of side frame plates () bent from both ends of the central frame plate. A flexible substrate () has a central substrate () covering the central frame plate and bent substrates () bent from the central substrate so as to cover the side frame plates. An optical element () is mounted on the central frame plate. A plurality of internal wiring terminals () connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals () used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.

Optical device and method of manufacturing the same

The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.

Semiconductor laser unit and optical pickup device

An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.

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Kyoto, Japan

Shigeki Okamoto