Tdk Corporation

Shigeki Ohtsuka

Toshio Tomonari

Masahiro Nakano

Noritaka Chiyo

Hirohumi Asou

Tomohiro Moriki

Takahiro Ohishi

Takakazu Maruyama

Takaaki Imai

Shigeru Kaneko

Junpei Hayama

Akihito Watanabe

Shigenori Hirata

Masaki Sobu

Osamu Taguchi

Yasunaga Kagaya

Junpei Hamaya

Disclosed herein is a coil component that includes a first coil pattern wound in a planar spiral shape. At least one turn constituting the first coil pattern is divided into a plurality of lines by a spiral slit, and a space width between the plurality of lines differs depending on a planar position.

Coil component

Disclosed herein is a coil component that includes first and second substrates, a first coil pattern formed on one surface of the first substrate, a second coil pattern formed on one surface of the second substrate, a first terminal electrode connected to one end of the first coil pattern and protruding from the first substrate, and a second terminal electrode connected to one end of the second coil pattern and protruding from the second substrate. The first and second substrates are laminated such that the first and second terminal electrodes overlap each other and are connected to each other.

Coil component and wireless power transmission device provided with the same

In a SAW device comprising a piezoelectric single crystal substrate and electrodes on a surface thereof, the substrate is obtained by slicing a LiTaOor LiNbOmaterial such that a plane containing axis X and perpendicular to a new axis Y obtained by rotating axis Y about axis X by an angle of 33&#xb0;&#xb1;9&#xb0; becomes the substrate surface, and each electrode is a layered film including a titanium nitride layer and an aluminum layer thereon. The aluminum layer containing no grain boundaries ensures high efficiency, long life SAW devices experiencing no increase of electrical resistance.

Method of manufacturing a SAW device

A surface acoustic wave element includes a thin film electrode composed of monocrystal aluminum disposed on a piezoelectric substrate. At least one metal of Cu, Ta, W, and Ti is segregated in the thin film electrode composed of monocrystal aluminum. In this surface acoustic wave element, segregation of Cu or the like occurs in the thin film electrode. Such segregation is effective to reduce the occurrence of cracks on the piezoelectric substrate during ultrasonic wave connection for flip chip mounting. That is, because the occurrence of cracks on the piezoelectric substrate is reduced, tolerance against the ultrasonic vibration is advantageously improved in the surface acoustic wave element.

Surface acoustic wave element, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave element

SAW device and manufacturing method

Growing community of inventors

Tokyo, Japan

Shigeki Ohtsuka