Panasonic Corporation

Panasonic I-pro Sensing Solutions Co., Ltd.

I-pro Co., Ltd.

Shigeki Ogata

Naomi Shirai

Katsuya Okamoto

Yoshitaka Kitaoka

Hisahiro Tanaka

Kunihiko Hara

Toyokazu Yoshino

Shinji Morimoto

Haruhiko Kohno

Kouji Nakashima

Naoto Matsuo

An endoscope includes a scope provided with a hard portion at a distal end of a long flexible portion having flexibility; an image capturing portion housed in the hard portion and having an image sensor; a transmission cable inserted into the scope and conductively connected to the image sensor at a distal end via a substrate, and a voltage conversion device mounted on the substrate and outputting a constant voltage to the image sensor with respect to a input voltage input to the transmission cable.

Endoscope

An endoscope system includes a first light source that emits visible light, a second light source that emits non-visible light, an image sensor that generates a first image including a subject through first photoelectric conversion using the visible light and generates a second image including a subject that emits fluorescence emission light due to excitation by the non-visible light through second photoelectric conversion using the non-visible light, and an output device that alternately switches between and outputs the first image and the second image. The second light source starts light emission by a predetermined time before start of the second photoelectric conversion due to driving of the driving circuit.

Endoscope system and light source control method

Provided is an FPC, which comprises an insulating layer, wiring layersandlaminated above and under the insulating layer, and a layer connection for connecting the wiring layersandelectrically. The layer connection is constituted to comprise: a conductor press-fit holeof a cone shape extending through the insulating layerand the upper and lower wiring layersandand expanded to the side of one wiring layer; and a conductorfilled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layerdeformed into the cone shape of the conductor press-fit hole, and is protruded from the other wiring lower layerto have its surface partially coated and jointed. As a result, the contact area between the wiring layersandand the conductorfilled in the conductor press-fit holecan be enlarged to retain the contact strength between the wiring layersandand the conductorsufficiently thereby to provide a high connection reliability for the layer connection.

Manufacturing method of flexible printed wiring board

The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.

Tin-plated film and method for producing the same

Growing community of inventors

Fukuoka, Japan

Shigeki Ogata