Murata Manufacturing Co., Ltd.

Denso Corporation

Shigeki Nishiyama

Toru Itabashi

Ryoichi Shiraishi

Yuuki Mikami

Hiroaki Nakamura

Takahiko Furuta

Nobushige Moriwaki

Kazuhiro Yoshida

Yuki Mikami

Kazuyuki Kubota

Akihiro Yanagisawa

Yasuhiko Kubota

Kenichi Watanabe

Masahiro Nishio

Masaki Takeuchi

Shinichi Kobayashi

Hiroshi Nakagawa

Takeshi Azumi

Toru Murowaki

Yusuke Takahashi

Yoshihiro Omura

Naoki Tanimoto

Yoshinari Nakamura

Shoji Oka

Kazuyoshi Obara

Satoru Goto

Yuuto Kamiya

Toru Sirane

A capacitor that includes a substrate; a capacitor formation region in which one or more trenches are formed; a dummy region located between the capacitor formation region and an end of the substrate; a first electrode formed inside the one or more trenches to cover the capacitor formation region, and a dielectric film; a second electrode that covers the capacitor formation region and has a different potential from the first electrode; and an extended portion that formed in the dummy region. Moreover, the extended portion forms a recess or a protrusion on the substrate in a path from the second electrode to the end portion of the substrate.

Capacitor

A semiconductor capacitor includes a semiconductor substrate having a first and second principal surfaces. A first set of one or more trenches is formed on the first principal surface and a second set of one or more trenches formed on the second principal surface. A first dielectric film is located on the first principal surface and least inner walls of the first set of one or more trenches. A second dielectric film is located on the second principal surface and least inner walls of the second set of one or more trenches. A first conductor film located on the first dielectric film. A second conductor film located on the second dielectric film. The semiconductor substrate is formed of Si, SiC, GaN, or the like. The dielectric film has a two-layer structure of SiOand SiN.

Semiconductor capacitor and power supply module

A capacitor circuit includes two ceramic capacitors that are connected in series. The two ceramic capacitors each have a ferroelectric layer interposed between conductive layers and have substantially identical direct-current bias characteristics such that an electrostatic capacitance during application of a voltage, which is half of a rated voltage, is larger than the electrostatic capacitance during application of the rated voltage higher than the voltage.

Capacitor circuit, capacitor module, and power conversion system

An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.

Electronic control device including interrupt wire

Provided is a capacitor module () for connection to a plurality of power conversion circuits, which includes: a dielectric part () that has a plurality of flat-film dielectric layers (A,B) laminated; a capacitance formation part () that has conductors opposed to each other with the dielectric layers (A,B) interposed therebetween within the dielectric part (); and multiple pairs of output terminals (A,B,C) that are connected respectively to the multiple power conversion circuits, where the multiple pairs of output terminals (A,B,C) are connected to each other with the capacitance formation part () interposed therebetween.

Capacitor module and power conversion device

A laminated film capacitor that includes a laminated body of first capacitance electrodes and second capacitance electrodes stacked to be opposed to each other with dielectric films interposed therebetween. A first external electrode is electrically connected to the first capacitance electrodes and a second external electrode is electrically connected to the second capacitance electrodes. The laminated film capacitor includes heat dissipators that are connected to the external electrodes, and higher in heat dissipation performance than at least one of the first capacitance electrodes and second capacitance electrodes. The heat dissipators are larger in thickness than at least one of the first capacitance electrodes and second capacitance electrodes.

Laminated film capacitor, film capacitor module, and power conversion system

A laminated film capacitor that includes a laminated body having alternately stacked first dielectric films with respective first internal electrodes and second dielectric films with respective second internal electrodes, a first metallikon part connected to the first internal electrodes, and a second metallikon part connected to the second internal electrodes, and the laminated body has principal surfaces in the shape of a trapezoid as viewed from the stacking direction of the first dielectric films and the second dielectric films.

Laminated film capacitor, capacitor module, and power conversion system

An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has multiple leg portions divided by slits. A first leg portion forms an electrical path portion having a cut-off portion, a width of which is smaller than that of other portions of the electrical path portion. A second leg portion has a first supporting leg and a second supporting leg, which are arranged at both sides of the first leg portion. Each of the supporting legs is connected to each of dummy lands formed in the printed board.

Electronic part and electronic control unit

A main body of an electronic part has multiple electrodes, to which multiple terminals are connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The normal terminal holds the main body at the position above and separated from the board surface even in a case of melt-down of the cut-off portion.

A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a fuse terminal and a normal terminal, each of which extends from the main body to a printed board so that the main body is supported at a position above and separated from a board surface of the printed board. The fuse terminal has an intermediate portion between an electrode-connected portion and a land-connected portion. The intermediate portion has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The intermediate portion extends in a direction parallel to the board surface or in a direction inclined to the board surface at an angle smaller than 90 degrees.

A main body of an electronic part is supported by terminals at a position above and separated from a board surface of a printed board. Each of the terminals is composed of a supporting member made of electrically insulating material and a wiring member. Each of the wiring member has an electrode-connected portion electrically connected to an electrode formed on the main body and a land-connected portion electrically connected to a land formed in the printed board. One of the wiring members is composed of a fuse wiring member having a cut-off portion, which is melted down when excess current flows. The wiring member is outwardly expanded in a direction opposite to the main body.

A main body of an electronic part is formed in a rectangular pillared shape having a first and a second axial end surface. A first electrode is formed on the first axial end surface electrically and mechanically connected to a first wiring pattern formed on a board surface of a printed board. A second electrode is formed on the second axial end surface, to which one end of a fuse terminal is electrically connected. The other end of the fuse terminal is connected to a second wiring pattern of the printed board or a wiring member which is formed as an independent member from the printed board. A cut-off portion is formed in a connecting portion of the fuse terminal.

An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.

Growing community of inventors

Nagaokakyo, Japan

Shigeki Nishiyama