Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Shigeki Monma

Mitsuhiko Kitagawa

Hiromichi Ohashi

Tomiya Sasaki

Setsuo Suzuki

Osami Morimiya

Yoshio Kamei

Masaru Ishizuka

Asako Matsuura

Yasuyuki Yokono

A semiconductor switching apparatus includes a member for radiating heat generated from semiconductor switching element chips and for reducing a thermal stress. The lengths of gate electrode wires are equally set. The semiconductor switching apparatus has a large capacity and good switching characteristics.

Power semiconductor switching apparatus with heat sinks

Discharge apparatus comprises a vacuum envelope which is evacuated by a pamping apparatus. In the envelope, an anode and a hollow cathode are disposed and are connected to an arc power supply. A disk having an orfice covers one end of the hollow cathode. A low pressure gas is supplied from a gas source to the envelope through the hollow cathode and the orifice, the gas pressure in the hollow cathode being maintained higher than that in the envelope. The hollow cathode and the disk are made of an electrically conductive material and are connected to an ignition power supply. Before effecting discharging between the anode and the hollow cathode, the ignition power supply causes an ignition between the disk and the inner surface of the hollow cathode.

Discharge apparatus having hollow cathode

Growing community of inventors

Yokohama, Japan

Shigeki Monma