Dai Nippon Printing Co., Ltd.

Shigeki Kawano

Katsuya Sakayori

Hiroko Amasaki

Hiroshi Yagi

Terutoshi Momose

Michiaki Uchiyama

Tomoko Togashi

Satoshi Sasaki

Tsuyoshi Yamazaki

Kazuo Umeda

Nobuhiro Sakihama

Jiro Takei

Kazunari Ikeda

Yukio Iimura

Makoto Shimose

Kazuto Okamura

Hidetsugu Tazawa

Kazutoshi Taguchi

Kazunori Ohmizo

Kouhei Ohno

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

Wet etched insulator and electronic circuit component

There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360&#xb0; C. and is dissolvable in a basic solution at a rate of more than 3 &#x3bc;m/min, preferably more than 5 &#x3bc;m/min, and most preferably more than 8 &#x3bc;m/min.

Laminate and use thereof

It is a primary object of the present invention to provide a suspension substrate having reduced strain. The present invention solves the problem by providing a suspension substrate comprising: a fundamental structure in which a metal substrate, a first insulation layer, and a wiring are laminated in this order; a wide wiring laminate structure provided with a wide wiring first insulation part of the first insulation layer, a first wide wiring formed on the wide wiring first insulation part, a second insulation part formed on the first wide wiring, and a second wide wiring formed on the second insulation part; and a narrow wiring-containing structure provided with a narrow wiring first insulation part of the first insulation layer and a first narrow wiring formed on the narrow wiring first insulation part, wherein the narrow wiring-containing structure is provided with a strain-limiting part formed to limit strain generated in relation to the wide wiring laminate structure.

Suspension substrate, suspension, head suspension and hard disk drive

The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.

Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer&#x2014;insulating layer&#x2014;second inorganic material layer or a layer construction of inorganic material layer&#x2014;insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

A wireless suspension blank is made using a two-layer laminate composed of a metallic layer with the spring property and an electrically insulating layer. The first method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the wet-etching method. The second method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the plasma etching method. The third method includes a first step for forming a wiring part on the metallic layer by the semi-additive method, a second step for working the metallic layer by the wet-etching method and a third step for working the insulating layer by the dry-etching method or the wet-etching method. The use of a two-layer laminate makes possible a low cost production. Further, the forming of a wiring part by the semi-additive method makes possible to working very accurately a fine wiring part.

Method of manufacturing wireless suspension blank

A method of manufacturing a wireless suspension blank wherein three-layered laminate formed of a metallic layer having a spring property and a conductive layer laminated on the metallic layer through an electrically insulating layer are used. The laminate used is a laminate in which an insulating layer is formed of a core-insulating layer and adhesive layers laminated on both sides of the core-insulating layer, and the ratio of higher etching rate to lower etching rate of the respective layers of the insulating layer is between 6:1 and 1:1. The metallic layer and the conductive layer are processed by the photo etching method. The insulating layer is processed by the wet etching method.

The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment. The production process of an electronic component comprises the steps of: wet etching a laminate of conductive inorganic material layer&mdash;insulating layer&mdash;conductive inorganic material layer or a laminate of conductive inorganic material layer&mdash;insulating layer to pattern the conductive inorganic material layer; and then performing wet etching to pattern the insulating layer. The patterning of the insulating layer by wet etching is carried out in a continuous form using a dry film resist; and, the dry film resist is laminated by roll pressing onto the laminate under a reduced pressure of not more than 80 KPa.

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Tokyo-to, Japan

Shigeki Kawano