Hitachi Chemical Company, Ltd.

Hitachi Chemical Dupont Microsystems, Ltd.

Shigeki Katogi

Takashi Masuko

Takashi Kawamori

Masami Yusa

Masaaki Yasuda

Kazuyuki Mitsukura

Hiroyuki Izawa

Houko Sutou

Tohru Fujinawa

Hiroshi Matsutani

Michiko Natori

Toshiaki Shirasaka

Akitoshi Tanimoto

Hiroki Hayashi

Yu Aoki

Shingo Tahara

Shinichirou Sukata

Aya Momozaki

Takanobu Kobayashi

Hoko Suto

Makoto Kaji

Hiroshi Suzuki

Hideo Hagiwara

Shigeru Nobe

Tomonori Minegishi

Masataka Nunomura

Yasunori Kojima

Mitsumasa Kojima

Hidetaka Satou

Minoru Sugiura

Kei Kasuya

Kouichi Abe

Dai Kawasaki

The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).

Solar cell module and method of manufacturing thereof

There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein Rrepresents a hydrogen atom or a hydrocarbon group; Rrepresents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110&#xb0; C. after exposure and further heat curing is not less than 10 MPa.

Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

A photosensitive resin composition including: (a) a polybenzoxazole precursor; (b) a photosensitizer; (c) a solvent; (d) a cross-linking agent; and (e) a heterocyclic compound including a hydroxyl group, an alkoxy group or a carboxyl group within a molecule.

Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component

A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220&#xb0; C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring membersto electrodesconnected to a solar battery cell

Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module

The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor devicecomprising a step of patterning the photosensitive adhesiveprovided on a circuit surface of a semiconductor chipby light exposure and development; and a step of directly bonding another semiconductor chipto the patterned photosensitive adhesive

Method of producing semiconductor device with patterned photosensitive adhesive

The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100&#xb0; C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group.

Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

A method for manufacturing a semiconductor device, comprising a first step of providing a photosensitive adhesive (insulating resin layer) on a boardwhich has a connecting terminal, a second step of patterning the photosensitive adhesive by light exposure and development so that openingsare formed where the connecting terminal is exposed, a third step of filling the openingswith a conductive material to form a conductive layer, and a fourth step of directly bonding a semiconductor chiphaving a connecting electrode section to the photosensitive adhesive while electrically connecting the connecting terminal of the boardand the connecting electrode section of the semiconductor chipvia the conductive layer

Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device

The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

Growing community of inventors

Tsukuba, Japan

Shigeki Katogi