Nec Corporation

Shigeki Hoshino

Michinobu Tanioka

Toru Taura

Masahiro Tsuchiya

Mizuki Iwanami

Masato Kishi

A plurality of LSI chips () are stacked on an interposer (). Signal coils () for signal transmission are formed on the circuit formation surfaces of LSI chips () that are formed using silicon substrates (). The signal coils () connect to circuits formed in the LAI chips (). Through-holes () are formed in the centers of the signal coils () of the silicon substrate (). Signal coils () connected to solder balls () by way of through-conductors () are formed on the interposer (). Magnetic pins () that are composed of a magnetic material are inserted in the centers of the signal coils (and).

Semiconductor device for implementing signal transmission and/or power supply by means of the induction of a coil

The semiconductor device testing apparatus has a testing LSI; a power supply unit; and an intermediate substrate. The testing LSI has a dielectric material layer facing a tested semiconductor device; an electrode disposed in a position corresponding to a position of an external terminal electrode of the tested device on a surface of the dielectric layer facing the tested device; and a first penetrating electrode that passes completely through the dielectric layer, is connected to the electrode, and is used for exchanging signals with the exterior. The power supply unit has mutually independent elastic probe pins that are disposed in positions corresponding to power electrodes of the tested device, and that are provided with a metal protrusion at the distal ends thereof; a substrate on which a first wiring layer is formed and is electrically connected to the probe pins; and a second penetrating electrode that passes through the substrate.

Semiconductor device testing apparatus and power supply unit for semiconductor device testing apparatus

A condenser lens is incorporated into the end portion of a magnetic field measuring apparatus including a magneto-optical crystal. Alternatively, the end portion of the magnetic field measuring device includes an optical fiber having a core diameter smaller than that of a normal single-mode optical fiber.

Magnetic field measuring apparatus capable of measuring at high spatial resolution

The intensity of electric and magnetic component is measured at a high-speed without reducing spatial resolution. An electric and magnetic field detection device has an electric field detection device for detecting an electric field component, and a magnetic field detection device for detecting a magnetic field component. These detection devices are so formed on a multilayer printed circuit board that they can be operated independently.

Growing community of inventors

Tokyo, Japan

Shigeki Hoshino