Seiko Epson Corporation

Shigekazu Takagi

Satoshi Fujii

Mitsuhiro Yoda

Yutaka Takada

Seiji Yamazaki

Shuichi Kawano

Kesatoshi Takeuchi

Atsuki Naruse

Satoru Tanaka

Teruo Takizawa

Shogo Inaba

Akira Sato

Tomokazu Umeno

A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.

Physical quantity sensor, inertia measurement device, vehicle positioning device, portable electronic apparatus, electronic apparatus, and vehicle

A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.

Manufacturing method of inertial sensor and inertial sensor

A manufacturing method of an electronic device includes a process that forms a protective layer on at least a portion of the first base body to which a third base body is to be bonded, a process that performs first bonding of a second base body to the first base body, a process that performs a first etching of the second base body bonded by the first bonding, a process that removes the protective layer using a second etching, and a process that performs second bonding of the third base body to the first base body. In the first etching, an etching rate of the second base body is faster than those of the first base body and the protective layer, and in the second etching, an etching rate of the protective layer is faster than those of the first base body and the second base body.

Manufacturing method of electronic device, electronic device, electronic apparatus, and moving body

A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.

Functional device, method of manufacturing the functional device, physical quantity sensor, and electronic apparatus

An electronic device includes a substrate, a lid which is bonded to the substrate, and a functional element which is provided between the substrate and the lid, in which the lid includes a penetration hole which penetrates a portion between an inner surface and an outer surface, the penetration hole includes a first hole portion and a second hole portion, a flat area of the second hole portion is set to be smaller than a flat area of the first hole portion, at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion, and the penetration hole is sealed with a sealing member.

Electronic device having a cover in which a penetration hole is provided and manufacturing method of electronic device

A sensor element includes: a detection electrode section; a movable body that is provided to face the detection electrode section; and a protruding section that is provided in a region where the detection electrode section is provided in a plan view of the detection electrode section seen in a vertical direction and protrudes toward the movable body. At least a part of a surface of the protruding section is made of an insulating material.

Sensor element, electronic apparatus and moving object

An electronic device includes a first member including a reference potential terminal; a second member placed on a first surface of the first member and having conductivity; and a functional element accommodated in a cavity surrounded by the first member and the second member, wherein the second member and the reference potential terminal are electrically connected via a contact portion.

Electronic device, method for manufacturing thereof, and electronic apparatus

An electronic device includes: a first member having a first surface; a second member placed on the side of the first surface; a functional element accommodated in a cavity formed by the first member and the second member; an external connection terminal disposed outside of the cavity on the side of the first surface of the first member; a groove portion disposed on the side of the first surface of the first member and extending from the inside to the outside of the cavity; a wiring disposed within the groove portion and electrically connecting the functional element with the external connection terminal; a first through-hole disposed at a position of the second member, the position overlapping the groove portion in plan view; and a filling member disposed within the first through-hole and filling the groove portion.

A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section.

Functional element, sensor element, electronic apparatus, and method for producing a functional element

The manufacturing of an element structure including two or more sensor element is to be facilitated. An element structure includes a first substrate including a first support layer and a first sensor element disposed on the first support layer and a second substrate including a second support layer and a second sensor element disposed on the second support layer, wherein the second substrate is disposed on the first substrate via a spacer member in a state in which the first sensor element and the second sensor element are disposed to face each other.

Element structure, inertia sensor, and electronic device

A MEMS sensor includes: a substrate; a fixed electrode portion formed in the substrate; a movable weight portion formed above the fixed electrode portion via a gap; a movable electrode portion formed in the movable weight portion and disposed so as to face the fixed electrode portion; a supporting portion; and a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable, wherein the movable weight portion is a stacked structure having conductive layers and an insulating layer, and plugs having a larger specific gravity than the insulating layer are embedded in the insulating layer.

MEMS sensor, method of manufacturing MEMS sensor, and electronic apparatus

An optical source device includes a solid high frequency oscillating unit that outputs a high frequency signal, a waveguide that receives the high frequency signal output from the solid high frequency oscillating unit and radiates the received high frequency signal as a microwave, and a light emitting unit that emits light by the microwave radiated from the waveguide unit. A container of the waveguide unit has a space surrounded by reflective surfaces that reflect the microwave radiated from the antenna unit so as to collect the microwave. A projector includes this optical source device, an optical modulating unit that modulates a light beam emitted from the light emitting unit of the optical source device according to image information to form an optical image, and a projecting unit that projects the optical image formed by the optical modulating unit.

Light source device and projector including light source device

A semiconductor device includes a semiconductor substrate including an active element or an integrated circuit and a plurality of connection electrodes to be electrically connected to the integrated circuit; a first resin layer formed on a surface of the semiconductor substrate on which the connection electrodes are formed in such a manner avoiding the connection electrodes; a connection wiring layer formed between the semiconductor substrate and the first resin layer and connected to one of the plurality of connection electrodes; a Cu wiring layer connected at one end thereof to the connection wiring layer and formed on the surface of the first resin layer; a passive element composed of the connection wiring layer and the Cu wiring layer; a second resin layer for covering a surface of the Cu wiring layer; and an external terminal electrically connected to some of the plurality of connection electrodes and formed such that a portion of the second resin layer protrudes from the second resin layer.

Semiconductor device and oscillator

To provide a projector using a light source device that is rapidly and reliably turned on and can stably obtain a desired amount of light and a method of rapidly and reliably turning on a light source device of a projector. A power control unit adjusts the amplification factor of an amplifying unit for microwaves such that microwave power having a pulse form that is higher than the microwave power radiated to keep an electrodeless lamp emitting light is radiated to turn on the electrodeless lamp. Therefore, a microwave having predetermined power is radiated to the electrodeless lamp at once.

Growing community of inventors

Shimosuwa, Japan

Shigekazu Takagi