Tokyo Electron Limited

Dainippon Screen Mfg. Co., Ltd.

Other

Fuji Electric Systems Co. Ltd.

Octec, Inc.

Nippo Precision Co., Ltd

Shigekazu Komatsu

Kunihiro Furuya

Junichi Hagihara

Tadayoshi Hosaka

Naoki Muramatsu

Dai Shinozaki

Takahisa Hayashi

Hiromi Chaya

Toshihiro Itoh

Kenichi Kataoka

Yasunori Kumagai

Mitsuyoshi Miyazono

Katsuaki Sakamoto

Katsuya Okumura

Yuichi Abe

Atsushi Yoshida

Tadatomo Suga

Jun Mochizuki

Takashi Amemiya

Takanori Hyakudomi

Vincent Vezin

Kenichi Kubo

Syuichi Tsukada

Masahiro Kato

Kazuya Asaoka

Yukihide Shigeno

A wafer inspection system is provided. The wafer inspection system includes: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

Wafer inspection system

A wafer inspection system is provided. The wafer inspection system comprises: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

Wafer inspection system, wafer inspection apparatus and prober

Test head and wafer inspection apparatus

A maintenance carriage of a wafer inspection apparatus can easily unload a test head. A wafer inspection apparatusincludes a cell towerin which cellsare arranged at four levels, and each of the cellsaccommodates a test head. At an outside of the cell tower, a maintenance carriageis arranged. The maintenance carriageincludes a carriage baseconfigured to be moved through rollers; a test head caseconfigured to accommodate the test head; a lift deviceprovided uprightly from the carriage baseand configured to move up and down the test head case; and a horizontal position adjusting stageprovided between a lifterof the lift deviceand the test head caseand configured to move the test head casehorizontally with respect to the lifter

Maintenance carriage for wafer inspection apparatus and maintenance method for wafer inspection apparatus

A probe includes a contact member brought into contact with an object to be tested. Contact particles having conductivity are uniformly distributed in the contact member. A part of the contact particles protrude from a surface of the contact member on the side of the object to be tested. A conductive member having elasticity is placed on a surface of the contact member on the opposite side to the object to be tested. The probe further includes an insulating sheet including a through hole and the contact member is so positioned as to penetrate the through hole. An upper part of the contact member is formed of a conductor which does not include the contact particles. An additional conductor is placed on a surface of the conductor on the side opposite to the object to be tested.

Probe

A probe card installed in a probe device includes a supporting plate capable of supporting a contact body and a circuit board installed above a top surface of the supporting plate. A connection member is installed at a top surface of the circuit board and the supporting plate and the connection member are connected to each other by a connection body. Load control members are installed at a top surface of the connection member and capable of maintaining a contact load between the contact body and an object to be inspected at a constant level. Elastic members are installed at a peripheral portion of the connection member and capable of fixing a horizontal position of the supporting plate. An intermediate member is installed between the circuit board and the supporting plate and configured to elastically and electrically connect the circuit board and the supporting plate.

Structure of probe card for inspecting electrical characteristics of object to be inspected

A holding member for use in a test includes a base made of silicon or glass and chips in which devices are formed is mountable thereon. Positioning members made of resist sheets are formed on the top surface of the base. A resist film is formed on the bottom surface of the base, and suction grooves (intersection portions, connection portions) and support members are formed in the resist film. Suction holes are formed in regions of the top surface of the base where the chips are mounted, wherein the suction holes are formed through the base and communicate with the suction groove.

Holding member for use in test and method for manufacturing same

A yield and productivity of a semiconductor module are improved. A sheet having electrical conductivity is fixed to a main surface of a semiconductor substrate on which a plurality of semiconductor devices having a surface structure and a rear surface electrode are arranged. The semiconductor substrate is divided into semiconductor chips on a first support stage in the state where the sheet is fixed to its main surface. The plurality of divided semiconductor chips are mounted on a second support stage via the sheet and further, the plurality of mounted semiconductor chips are continuously subjected to a dynamic characteristic test on the second support stage. The proposed semiconductor device evaluation method permits a fissure growing and propagating from a crack occurring in the dynamic characteristic test of the vertical semiconductor devices to be suppressed, and the yield and productivity of the semiconductor module to be improved.

Method for evaluating semiconductor device

Installed in a probe device is a holding member for inspection which can be mounted on a chuck. The holding member for inspection includes a support plate capable of mounting thereon a chip in which the power device is formed; pins for positioning the chip mounted on the support plate; and a metal film formed on a surface of the support plate in a range from a mounting area on which the chip is mounted to an exposed area on which the chip is not mounted. When inspecting the power device, the chip is fixed onto the mounting area in the holding member for inspection, one probe pin is brought into contact with a terminal on a top surface of the chip; and another probe pin is brought into contact with the metal film in the exposed area.

Holding member for inspection, inspection device and inspecting method

A probe method of this invention includes a step of reducing an electrode of a wafer by using a forming gas, and a step of bringing the electrode and a probe pin into contact with each other in a dry atmosphere. The probe method further includes, prior to a reducing process of an electrode of the object to be tested, placing the object to be tested in an inert gas atmosphere and heating the object to be tested. The reducing process is performed by bringing a reducing gas into contact with the electrode of the object to be tested under atmospheric pressure.

Probe method, prober, and electrode reducing/plasma-etching processing mechanism

A circuit for protecting a DUT is disposed in parallel with a DUT which is supplied with current via wirings and switchable between conducting and non-conducting state. The circuit is switchable between conducting and non-conducing state and switched from non-conducting state to conducting state as the DUT is switched from conducting state to non-conducting state.

Circuit for protecting DUT, method for protecting DUT, testing apparatus and testing method

The probe card is configured such that the outline of the probe card is formed almost round shape and a plurality of connectors for being electrically connected with a tester are provided on the upper surface thereof along the outline. A substrate with many probes arranged thereon is provided on the bottom surface of the probe card. The substrate and the connectors are connected with one another via a flexible print wiring board.

Probe card and probe device for inspection of a semiconductor device

Growing community of inventors

Nirasaki, Japan

Shigekazu Komatsu