Hitachi, Ltd.

Hitachi Construction Machinery Co., Ltd.

Shigekazu Kieda

Kenichi Hattori

Hideaki Mori

Ryoichi Shiobara

Masayuki Kaiho

Takahiro Daikoku

Hitoshi Yokono

Tadakatsu Nakajima

Shinichi Tachi

Motohiro Sato

Fumiyuki Kobayashi

Kazunori Tsujimoto

Shizuo Zushi

Akiyoshi Komura

Heikichi Kuwahara

Kiichiro Mukai

Tadashi Sonobe

Takayuki Atarashi

Yasunori Ota

Takao Terabayashi

Masafumi Kanetomo

Shuichi Terakado

Shinya Okumura

Shigehisa Funabashi

Yoshiki Abe

Akitomi Senba

Keijiro Shindo

Kenshiro Tamura

Nobuo Kayaba

The construction machine including an engine room having an engine, a radiator ii for cooling the engine, and a hydraulic pump which are arranged therein, and a counterweight area which is located adjacent to the engine room and in which batteries are installed, a ventilation passage for cooling the engine room and a ventilation passage for cooling the batteries are formed separately and independently in the substantially same direction, and a flowing direction of cooling air flowing in the ventilation passage for cooling the engine room and a flowing direction of cooling air flowing in the ventilation passage for cooling the batteries are substantially parallel to each other.

Cooling structure for construction machine

A turbine electric power generator is provided with winding slots and sub-slots of a rotor; rotor windings having conductors and insulation materials laminated alternately thereon; wedges; and radial ventilation flow passages communicating the sub-slots with through holes of the wedges. In this turbine electric power generator, a projection is provided on an inner face of the radial ventilation flow passages, and the projection height is changed at a rotational axial position. In this manner, there can be provided a gas cooling type rotary electric power generator for turbine with its high cooling performance and high reliability at a low cost.

Rotary electric power generator

There is provided an electric rotary machine having, in particular, a large capacity, in which a volume of cooling air is ensured for the axially center part thereof so as to make the temperature distribution uniform in the axial direction of the rotor and the stator. Each of gas coolers in the electric rotary machine is divided into not less than two of passage parts in which streams run in two directions in opposite to each other are created, and a stator-cooling connection passage is formed so as to connect not less than two passage parts located in the radially outward part of the stator and axially defined by partition walls with the passage parts in the gas coolers in the electric rotary machine. With this arrangement, cold gas can be led into the axially center part of the stator without increasing the total ventilation resistance, and accordingly, it is possible to prevent occurrence of temperature rise in the axially center parts of the stator and the rotor, which would be caused in the electric rotary machine having, in particular, a large capacity.

Rotary electric machine

For obtaining an electric rotating machine being constructed cheaply, while cooling capacity at the end portions of the rotor coils can be improved, and being small in the size and large in the capacity, with superior reliability thereof, in an electric rotating machine, within which a coolant fluid is circulated, wherein coil support members are positioned at a distance therebetween, in a space defined between the end portions B of the plural rotor coils, each of the coil support members is formed with two (2) insertion portions extending in a radial direction and a connector portion connecting therebetween, as one body and in an about &ldquo;H&rdquo; shape in the cross-section, thereby forming spaces , each of which faces the end portion B of the rotor coil, at both sides of the connector portion

Electric rotating machine

Efficient ventilation and cooling for a rotor is realized at a low cost by reducing the pressure loss at inlet flow passages, which lead to axial flow passages through which cooling gas flows to the rotor. Inlet flow passages leading to axial flow passages for cooling an interior of the rotor are composed of convex portions, which are formed axially on surfaces of a rotor spindle between and below coil ends of the rotor, and concave grooves formed between the convex portions. Also, the convex portions are designed to have a height increasing toward a downstream side, and assuming that L designates an length of the convex portions, L is greater than a radial difference between the positions of a maximum radius and a minimum radius of the convex portions.

A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.

Cooling arrangement for semiconductor devices and method of making the

A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.

Semiconductor cooling device

A dry etching apparatus is disclosed, in which the temperature of an article to be etched, placed on a wafer table, is controlled by a liquefied gas and a heater and the height of the surface of the liquefied gas can be varied arbitrarily. This apparatus enables the controlling of the temperature of the article to be done with a high accuracy over a wide range of low levels. Therefore, a low-temperature dry etching operation, which cannot otherwise be attained by a conventional apparatus of this kind, can be carried out.

Dry etching apparatus

Growing community of inventors

Ishioka, Japan

Shigekazu Kieda