Ibiden Company Limited

Shigeharu Ishikawa

Kazushige Ohno

Masafumi Kunieda

Kazutake Ogyu

Masahiro Tsuji

Shigeaki Goto

Toyoki Ogasawara

Naoyuki Jimbo

Yuji Okuda

Atsushi Mishima

Katsuyuki Kiriyama

Kazutaka Majima

Hideki Takagi

Hiroyuki Yasuda

A honeycomb structure is provided that includes a plurality of pillar-shaped honeycomb fired bodies, each having a number of cells longitudinally disposed in parallel with one another with a cell wall therebetween. An adhesive layer is interposed between adjacent honeycomb fired bodies of the plurality of honeycomb fired bodies to combine the plurality of honeycomb fired bodies together, and a sealing material layer is formed on an outer peripheral face of the combined plurality of honeycomb fired bodies. At least two honeycomb fired bodies of the plurality of honeycomb fired bodies have an outer wall that forms a portion of the outer peripheral face of the combined plurality of honeycomb fired bodies. At least one of the outer walls has a protruding portion extending from a surface thereof, and the protruding portion is made from a same material as a material of the at least one outer wall.

Honeycomb structure

Particulate filter for diesel engine

A honeycomb structure includes a ceramic block formed by a plurality of pillar-shaped honeycomb fired bodies each having a large number of cells longitudinally disposed in parallel with one another with a cell wall between the cells. The plurality of honeycomb fired bodies are combined with one another by interposing an adhesive layer with a sealing material layer formed on a peripheral face of the ceramic block and include a plurality of different shapes of the honeycomb fired bodies. A thickness of a peripheral wall forming the peripheral face of the ceramic block is virtually even. A shape of a cell located at an outermost periphery of the ceramic block is virtually identical with a shape of a cell located at a place other than the outermost periphery of the ceramic block. On the peripheral wall of the honeycomb fired body, a step is provided.

Honeycomb structure and method for manufacturing honeycomb structure

A method is provided that includes extrusion-molding a raw material composition containing ceramic powder and a binder to manufacture a coupled honeycomb molded body having a shape in which a plurality of pillar-shaped honeycomb molded bodies, each having a number of cells disposed in parallel with one another in a longitudinal direction with a cell wall therebetween, are integrated with one another by interposing a coupling portion. The method includes firing the coupled honeycomb molded body to manufacture a coupled honeycomb fired body, cutting the coupling portion to manufacture coupling-portion-cut honeycomb fired bodies, and binding a plurality of honeycomb fired bodies by interposing an adhesive layer, where at least one of the bound honeycomb fired bodies is a coupling-portion-cut honeycomb fired body.

Method for manufacturing honeycomb structure and extrusion-molding method for forming coupled honeycomb molded body

The vacuum chuck according to the present invention is provided with a sucking plate for sucking and holding an object to be sucked, in which a sucking layer made of a porous ceramic and a dense material layer are integrated, the sucking layer being located on the side for sucking the object to be sucked, wherein the dense material layer is formed by impregnating the porous ceramic with a metal.

Vacuum chuck and suction board

A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table () includes a plurality of superimposed bases () each of which is formed of silicide ceramic or carbide ceramic. The bases () are joined together by an adhesive layer (). A fluid passage () is formed in a joining interface between the bases ().

Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer

A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

Wafer holding plate for wafer grinding apparatus and method for manufacturing the same

A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

Growing community of inventors

Ibi-gun, Japan

Shigeharu Ishikawa