Hitachi Electronics Engineering Co., Ltd.

Shigeharu Iizuka

Yasuo Yatsugake

Takashi Okawa

Norihiko Mizutani

A wafer surface inspection method and device including a low angle light receiving system having an elevation angle less than 30.degree. with reference to the wafer surface, and a high angle light receiving system having an elevation angle equal to or larger than 30.degree., scans the wafer with a laser beam, receives scattered light to perform extraneous substance detection in response to the scanning, and detects wafer defects only by the high angle light receiving system, and sticking extraneous substances by either the low angle receiving system or by both the low angle light receiving system and the high angle light receiving system.

Growing community of inventors

Honjo, Japan

Shigeharu Iizuka