Alps Electric Co., Ltd.

Shigeaki Yamauchi

Katsuya Kikuiri

Hisanobu Okawa

Tetsuya Fukuda

Yoshinobu Nakamura

Chiaki Kera

Kazushige Sejimo

A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.

Sensor package

A pressure sensor includes a gold-silicon eutectic crystal layer interposed between the contact layer and the silicon substrate. Because the contact layer and the silicon substrate are electrically connected to each other by using a gold-silicon eutectic reaction at the time of bonding the silicon substrate and the glass substrate, a contact resistance between the contact layer and the silicon substrate can be stabilized, and a Q value of the sensor can be stabilized. In addition, since the contact layer and the silicon substrate are bonded to each other by the gold-silicon eutectic reaction, the bonding strength is sufficient.

Pressure sensor having gold-silicon eutectic crystal layer interposed between contact layer and silicon substrate

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Tokyo, Japan

Shigeaki Yamauchi