Sanyo Electric Co., Ltd.

Shigeaki Mashimo

Noriaki Sakamoto

Yoshiyuki Kobayashi

Kouji Takahashi

Junji Sakamoto

Eiju Maehara

Katsumi Okawa

Hirokazu Fukuda

Hiroki Etou

A semiconductor device is provided wherein conductive paths, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin, and the back surface of the conductive pathis exposed through the insulating resinand sealed. With this arrangement, fractures of the conductive pathsembedded in the insulating resinare suppressed.

Semiconductor device and semiconductor module

In the present invention there is formed a sheet-like board memberhaving conductive coating films, such as first padsand die pads, formed thereon or a sheet-like board memberwhich has been half-etched by using conductive coating films such as first padsand die pads. A hybrid IC can be manufactured by means of utilization of post-processing processes of a semiconductor manufacturer. Further, a hybrid IC can be manufactured without adoption of a support board, and hence there can be manufactured a hybrid IC which is of lower profile and has superior heat dissipation characteristics.

Sheet-like board member and method of manufacturing a semiconductor device

Hybrid integrated circuit device

A method of manufacturing a semiconductor device is described. A board that includes a flat back face, corresponding to a resin sealing area, and a front face that has projections is provided. The projections are formed of a metal that is integral with the board and include (a) a bonding pad provided in an area surrounded by an area that contacts an upper die, (b) a wiring that is integrated with the bonding pad and which extends to a semiconductor element mounting area, and (c) an electrode provided in one body with the wiring. A semiconductor element is mounted on the semiconductor element area and electrically connected to the bonding pad. The board is placed on a lower die and resin is filled into a space formed by the board and upper die. The board is divided into multiple devices such that the projections are separated by removing the board exposed at the back face of the resin.

Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof

After a trenchis formed in a conductive foil, the circuit elements are mounted, and the insulating resin is applied on the conductive foilas the support substrate. After being inverted, the conductive foilis polished on the insulating resinas the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive pathsand the circuit elementsare supported by the insulating resin, without the use of the support substrate. And the interconnects Lto Lrequisite for the circuit are formed, and can be prevented from slipping because of the curved structureand a visor

Circuit device and manufacturing method of circuit device

After a trenchis formed in a conductive foil, the circuit elements are mounted, and the insulating resin is applied on the conductive foilas the support substrate. After being inverted, the conductive foilis polished on the insulating resinas the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive pathsand the circuit elementsare supported by the insulating resinwithout the use of the support substrate. And the interconnects Lto Lrequisite for the circuit are formed, and can be prevented from slipping because of the curved structureand a visor

Circuit device and manufacturing method of circuit device and semiconductor module

A device containing a flat member is provided, having a pattern for a bonding pad, a wiring, and an electrode, by half-etching through the flat member.

A light irradiating device ( ) having the good radiation characteristic comprises a plurality of conductive paths ( ) that are electrically separated, a photo semiconductor chips ( ) fixed onto desired conductive path ( ), and a resin ( ) for covering the photo semiconductor chips ( ) to support the conductive paths ( ) integrally.

Light irradiating device

After a trench is formed in a first conductive foil A, the circuit elements are mounted, and the insulating resin is applied on the laminated conductive foil as the support substrate. After being inverted, a second conductive foil B is etched on the insulating resin as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths and the circuit elements are supported by the insulating resin , without the use of the support substrate. And the interconnects L to L for the circuit are formed, and can be prevented from slipping because of the curved structure and a visor

Method of manufacturing the circuit device and circuit device

Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating device

After a trench is formed in a conductive foil , the circuit elements are mounted, and the insulating resin is applied on the conductive foil as the support substrate. After being inverted, the conductive foil is polished on the insulating resin as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths and the circuit elements are supported by the insulating resin , without the use of the support substrate. And the interconnects L to L requisite for the circuit are formed, and can be prevented from slipping because of the curved structure and a visor

After a trench is formed in a conductive foil , a circuit element is mounted in a flip chip method. Then, an insulating resin is covered on the conductive foil as a support substrate. After reversion, the conductive foil is polished over the insulating resin as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths and the circuit elements supported by the insulating resin can be produced without employing the support substrate.

Circuit device and method of manufacturing the same

There are provided the steps of preparing a conductive foil and then forming a plurality of conductive paths by forming isolation trenches, which are shallower than a thickness of the conductive foil, in the conductive foil except at least areas serving as the conductive paths, fixing respective photo semiconductor chips ( ) to desired conductive paths, molding a light transparent resin ( ) serving as a lens to cover respective photo semiconductor chips ( ) individually and to fill the isolation trenches, and removing the conductive foil on the side on which the isolation trenches are not provided. Therefore, a light irradiating device ( ), in which back surfaces of the conduction paths can be connected to the outside to thus eliminate through holes and which has the good radiation characteristic, can be implemented.

Light irradiating device manufacturing method

A semiconductor device is provided wherein conductive paths formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin and the back surface of the conductive path is exposed through the insulating resin and sealed. With this arrangement, fractures of the conductive paths embedded in the insulating resin are suppressed.

Growing community of inventors

Gunma, Japan

Shigeaki Mashimo