Life Technologies Corporation

Mgi Tech Co., Ltd.

Shifeng Li

James M Bustillo

Wolfgang Hinz

Jordan Owens

Keith Glen Fife

Cheng Frank Zhong

Jian Gong

Yan-You Lin

John Matthew Mauro

Kristopher Barbee

John F Davidson

Liang Wang

Scott C Benson

Shoulian Dong

Alexander J Mastroianni

Christina E Inman

David Keys

Jonathan Putnam

Theodore Straub

An apparatus for forming a plurality of microdroplets () from a droplet () includes a substrate (), a dielectric layer () on the substrate () and having a plurality of hydrophilic surface regions () spaced apart from each other by a hydrophobic surface (), and a plurality of electrodes () in the dielectric layer (). The electrodes () are configured to form an electric field (E) across the droplet () in response to voltages provided by a control circuit () to move the droplet () across the dielectric layer () in lateral direction (F) while leaving portions of the droplet () on the hydrophilic surface regions () to form the plurality of microdroplets () on the hydrophilic surface regions ().

Apparatus and method for forming droplets having predetermined volume by electrowetting

A microfluidic apparatus () can include a PCB (), a biological chip () overlying the PCB (), and a microfluidic housing () overlying the biological chip () and the PCB (). The microfluidic apparatus () also has a first adhesive layer () attaching the microfluidic housing () to the biological chip () and a second adhesive layer () attaching the microfluidic housing () to the PCB (). The second adhesive layer () is thicker than the first adhesive layer (). The first adhesive layer () comprises a first adhesive material, and the second adhesive layer () comprises a second adhesive material.

System and method for integrated sensor cartridge

An apparatus () including multiple biological chips () includes a substrate (), a first adhesive layer () disposed on the substrate (), a first biological chip () and a second biological chip () disposed on the first adhesive layer () and attached to the substrate () by the adhesive layer (). The apparatus () further includes a filler () disposed between the first biological chip () and the second biological chip (). The filler () includes a second adhesive layer () extending between a side surface () of the first biological chip () and a side surface () of the second biological chip (), the second adhesive layer () attaching the first biological chip () to the second biological chip (). The filler () also includes a surface layer () disposed over the second adhesive layer (). The surface layer () has a hydrophobic surface that is co-planar with a top surface () of the first biological chip () and a top surface () of the second biological chip ().

System and method for integration of biological chips

A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.

Wafer level sequencing flow cell fabrication

A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.

Embodiments of the invention provide an improved biosensor for biological or chemical analysis. According to embodiments of the invention, backside illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensors can be used to effectively analyze and measure fluorescence or chemiluminescence of a sample. This measured value can be used to help identify a sample. Embodiments of the invention also provide methods of manufacturing an improved biosensor for biological or chemical analysis and systems and methods of DNA sequencing.

Biosensors for biological or chemical analysis and methods of manufacturing the same comprising a plurality of wells formed by a metal or metal oxide layer

Water level sequencing flow cell fabrication

The described embodiments may provide a method of fabricating a chemical detection device. The method may comprise forming a microwell above a CMOS device. The microwell may comprise a bottom surface and sidewalls. The method may further comprise applying a first chemical to be selectively attached to the bottom surface of the microwell, forming a metal oxide layer on the sidewalls of the microwell, and applying a second chemical to be selectively attached to the sidewalls of the microwell. The second chemical may lack an affinity to the first chemical.

Chemical coating of microwell for electrochemical detection device

In one implementation, a chemical device is described. The sensor includes a chemically-sensitive field effect transistor including a floating gate structure having a plurality of floating gate conductors electrically coupled to one another. A conductive element overlies and is in communication with an uppermost floating gate conductor in the plurality of floating gate conductors. The conductive element is wider and thinner than the uppermost floating gate conductor. A dielectric material defines an opening extending to an upper surface of the conductive element.

Chemical device with thin conductive element

In one implementation, a method for manufacturing a chemical detection device is described. The method includes forming a chemical sensor having a sensing surface. A dielectric material is deposited on the sensing surface. A first etch process is performed to partially etch the dielectric material to define an opening over the sensing surface and leave remaining dielectric material on the sensing surface. An etch protect material is formed on a sidewall of the opening. A second etch process is then performed to selectively etch the remaining dielectric material using the etch protect material as an etch mask, thereby exposing the sensing surface.

Methods for manufacturing well structures for low-noise chemical sensors

A chemical sensor is described. The chemical sensor includes a chemically-sensitive field effect transistor including a floating gate conductor having an upper surface. A material defines an opening extending to the upper surface of the floating gate conductor, the material comprising a first dielectric underlying a second dielectric. A conductive element contacts the upper surface of the floating gate conductor and extending a distance along a sidewall of the opening.

Chemical sensor with consistent sensor surface areas

A method of manufacturing a sensor, the method including forming an array of chemically-sensitive field effect transistors (chemFETs), depositing a dielectric layer over the chemFETs in the array, depositing a protective layer over the dielectric layer, etching the dielectric layer and the protective layer to form cavities corresponding to sensing surfaces of the chemFETs, and removing the protective layer. The method further includes, etching the dielectric layer and the protective layer together to form cavities corresponding to sensing surfaces of the chemFETs. The protective layer is at least one of a polymer, photoresist material, noble metal, copper oxide, and zinc oxide. The protective protective layer is removed using at least one of sodium hydroxide, organic solvent, aqua regia, ammonium carbonate, hydrochloric acid, acetic acid, and phosphoric acid.

Methods and systems for point of use removal of sacrificial material

In one implementation, a chemical sensor is described. The chemical sensor includes a chemically-sensitive field effect transistor including a floating gate conductor having an upper surface. A conductive element protrudes from the upper surface of the floating gate conductor into an opening. A dielectric material defines a reaction region. The reaction region overlies and extends below an upper surface of the conductive element.

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Fremont, CA, United States of America

Shifeng Li