Honeywell International Inc.

Nuvotornics, LLC

Shifang Zhou

Michael R Foster

Mark Eskridge

Michael J Foster

David W Sherrer

Ijaz H Jafri

Jorg Pilchowski

Uwe Pilchowski, Legal Representative

Christopher A Nichols

A stress isolator that allows a sensor to be attached to materials of the same coefficient of thermal expansion and still provide the required elastic isolation between the sensor and the system to which it is mounted. The isolator is made of two materials, borosilicate glass and silicon. The glass is the same material as the mounting surface of the microelectromechanical system (MEMS) sensors. The silicon makes an excellent isolator, being very elastic and easy to form into complex shapes. The two materials of the isolator are joined using an anodic bond. The construction of the isolator can be specific to different types of MEMS sensors, making the most of their geometry to reduce overall volume.

Anodically bonded strain isolator

A bi-directional, out-of-plane electrostatic comb drive apparatus including two electrically independent sets of stator comb tines; and a method for fabricating an out-of-plane comb drive with stacked sets of stator comb tines. A first set of stator comb tines is offset from a second set of stator comb tines. A set of rotor comb tines interleaves with both sets of stator comb tines. A first voltage applied to the first set of stator comb tines operates to pull the rotor tines toward the first set of stator comb tines. A second voltage applied to the second set of stator comb tines operates to pull the rotor tines toward the second set of stator comb tines, enabling bi-directional operation. A fabrication method is disclosed that enables fabrication of the first and second sets of stator comb tines that are mechanically and electrically independent and interleaved by the rotor comb tines.

Bidirectional, out-of-plane, comb drive accelerometer

System and methods offset mechanism elements during fabrication of Micro-Electro-Mechanical Systems (MEMS) devices. An exemplary embodiment applies a voltage across an offset mechanism element and a bonding layer of a MEMS device to generate an electrostatic charge between the offset mechanism element and the bonding layer, wherein the electrostatic charge draws the offset mechanism element to the bonding layer. The offset mechanism element and the bonding layer are then bonded.

Systems and methods for fabricating an out-of-plane MEMS structure

A device according to the present invention includes a MEMS device supported on a first side of a die. A first side of an isolator is attached to the first side of the die. A package is attached to the first side of the isolator, with at least one electrically conductive attachment device attaching the die to the isolator and attaching the isolator to the package. The isolator may include isolation structures and a receptacle.

Mechanical isolation for MEMS devices

A microelectromechanical system (MEMS) includes a housing defining an enclosed cavity, stator tines extending from the housing into the cavity, a MEMS device located within the cavity, the MEMS device including a proof mass and rotor tines extending from the proof mass, each rotor tine being positioned at a capacitive distance from a corresponding stator tine. The rotor tines include a first section extending a first distance from an insulating layer of the rotor tines and a second section extending a second distance from the insulating layer in an opposite direction from the first section. The stator tines include a first section extending a first distance from an insulating layer of the stator tines and a second section extending a second distance from the insulating layer in an opposite direction from the first section, the stator tine first distance being greater than the rotor tine first distance.

Sensor with position-independent drive electrodes in multi-layer silicon on insulator substrate

Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.

Three-dimensional microstructures having an embedded and mechanically locked support member and method of formation thereof

A microelectromechanical system (MEMS) device with a mechanism layer and a base. The top surface of the base is bonded to the mechanism layer and defines a gap in the top surface of the base. A portion of the mechanism layer is deflected into the gap until it contacts the base, and is bonded to the base.

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Redmond, WA, United States of America

Shifang Zhou