Sae Magnetics (h.k.) Limited

Shide Cheng

Ellis T Cha

Zhu Feng

A magnetic disk is protected by a bilayer. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlONor MeAlONwhere Mesymbolizes Ti, Sior Crand where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Magnetic disk comprising an aluminum alloy oxynitride underlayer and a diamond-like carbon overcoat

A protective bilayer on a magnetic read/write head or magnetic disk is formed as an adhesion enhancing and corrosion resistant underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is a transition metal oxynitride, having the general formula MeON, where Me represents a single element or an alloy of the following transition metal elements: Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W, here x can be within the range between 0 and 3 and y is in the range between approximately 0 and 2. Adjusting the values of x and y contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Methods of forming the adhesion layer, include reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Magnetic head/disk with transition metal oxynitride adhesion/corrosion barrier and diamond-like carbon overcoat bilayer

A method for forming a protective bilayer on a magnetic read/write head or magnetic disk. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlONor MeAlONwhere Mesymbolizes Ti, Sior Crand where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

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Fremont, CA, United States of America

Shide Cheng