Asml Netherlands B.v.

Shibing Liu

Yixiang Wang

Ying Luo

Jan-Gerard Cornelis Van Der Toorn

Allard Eelco Kooiker

Jurgen Van Soest

Jeroen Gertruda Antonius Huinck

Han Willem Hendrik Severt

Bohang Zhu

Arno Maria Wellink

Chia-Yao Chen

Juying Dou

Ronald Van Der Wilk

Qiang Li

Michael Johannes Christiaan Ronde

Michaël Johannes Christiaan Ronde

Shanhui Cao

Kangsheng Qiu

Yinglong Li

An electrostatic chuck control system configured to be utilized during an inspection process of a wafer, the electrostatic chuck control system comprising an electrostatic chuck of a stage configured to be undocked during the inspection process, wherein the electrostatic chuck comprises a plurality of components configured to influence an interaction between the wafer and the electrostatic chuck during the inspection process, a first sensor configured to generate measurement data between at least some of the plurality of components and the wafer, and a controller including circuitry configured to receive the measurement data to determine characteristics of the wafer relative to the electrostatic chuck and to generate adjustment data to enable adjusting, while the stage is undocked, at least some of the plurality of components based on the determined characteristics.

Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer

Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

Method, apparatus, and system for wafer grounding

Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

Object table comprising an electrostatic clamp

Growing community of inventors

San Jose, CA, United States of America

Shibing Liu